LiPOLY NEP220/NEP230 is a silicone-free two-part liquid gap filler that does not volatilize low-molecular-weight siloxane. With high viscosity and good adhesion, it can be fast cured at room temperature or elevated temperature. It provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe.

Datasheet: 

1.NEP220: 2.2 W/m*K

2.NEP230: 3.0 W/m*K

FEATURES:

• Can be applied with dispenser
• Room Temperature curing or heating curing
• Low compression stress during assembly
• Excellent adhesion to metal & PCB

TYPICAL APPLICATION:

• Electronic components: IC?CPU?MOS?Mother Board?Wireless Hub
• Telecom Device ?Automotive electronics?Computer Peripherals and High frequency magnetic inductor
• 5G base station & infrastructure
• EV electric vehicle

For more types of products, please refer to the LiPOLY website.

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Our products are also listed on Digikey and Verical