LiPOLY® 20W/m*K Conductive Gap Filler

Featured Product from Shiu Li Technology Co., Ltd

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LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.

Datasheet: T-work9000

FEATURES:

  • Thermal conductivity: 20.0 W/m*K
  • High compression rate
  • Extremely low thermal impedance

TYPICAL APPLICATION:

  • Flat-panel displays
  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware
  • 5G base station & infrastructure
  • High-end Chip

For more types of products, please refer to the LiPOLY website.

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