LiPOLY® 20W/m*K Conductive Gap Filler
Featured Product from Shiu Li Technology Co., Ltd
LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
Datasheet: T-work9000
FEATURES:
- Thermal conductivity: 20.0 W/m*K
- High compression rate
- Extremely low thermal impedance
TYPICAL APPLICATION:
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- High-end Chip
For more types of products, please refer to the LiPOLY website.
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