LiPOLY Exceptionally Soft Thermal Conductive Pad
Featured Product from Shiu Li Technology Co., Ltd

LiPOLY's BS and S series are ultra-soft and resilient thermal pads with excellent stress-strain characteristics, preventing installation stress from deforming PCBs and other components. With a thermal conductivity of 3.0–5.0 W/m*K, these gap-filling materials feature a Shore OO hardness of 10–25, offering high flexibility, compressibility, insulation, and self-adhesion. They effectively accommodate design tolerances and exhibit high stability. Custom cutting and stamping options are available to meet the unique demands of advanced products.
Features
- High compression rate
- Low thermal impedance
- High recovery
- Available in a range of thicknesses
Applications
- Notebook computers
- Heat pipe assemblies
- TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top-box
- IP CAM
Datasheet
For more types of products, please refer to the LiPOLY website.
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