LiPOLY Exceptionally Soft Thermal Conductive Pad

Featured Product from Shiu Li Technology Co., Ltd

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LiPOLY's BS and S series are ultra-soft and resilient thermal pads with excellent stress-strain characteristics, preventing installation stress from deforming PCBs and other components. With a thermal conductivity of 3.0–5.0 W/m*K, these gap-filling materials feature a Shore OO hardness of 10–25, offering high flexibility, compressibility, insulation, and self-adhesion. They effectively accommodate design tolerances and exhibit high stability. Custom cutting and stamping options are available to meet the unique demands of advanced products.

Features

  • High compression rate
  • Low thermal impedance
  • High recovery
  • Available in a range of thicknesses

 

Applications

  • Notebook computers
  • Heat pipe assemblies
  • TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top-box
  • IP CAM

Datasheet

For more types of products, please refer to the LiPOLY website.

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