LiPOLY® Exceptionally Soft Thermal Conductive Pad

Featured Product from Shiu Li Technology Co., Ltd

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LiPOLY S282-s is a thermally conductive pad designed for gap filling. The thermal conductivity is 2.5 W/m*K.

Using fiberglass reinforced layer and great self-adhesive which can fit closely with non-flat heat sinks to increase the contact area. S282-s is an excellent insulating material with characteristics of low stress damped vibration and shock absorption.

FEATURES

  • Thermal conductivity: 2.5 W/m*K
  • Designed for manufacturing
  • High dielectric breakdown
  • Shock and vibration absorber
  • Good mechanical strength
  • Fiberglass reinforced

TYPICAL APPLICATION

  • Flat-panel displays
  • LED, HDDs, DVDs
  • Heat pipe assemblies
  • Memory modules
  • Power supplies
  • 5G base station & infrastructure
  • EV electric vehicle

For more types of products, please refer to the LiPOLY website.

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