LiPOLY® Exceptionally Soft Thermal Conductive Pad
Featured Product from Shiu Li Technology Co., Ltd
LiPOLY S282-s is a thermally conductive pad designed for gap filling. The thermal conductivity is 2.5 W/m*K.
Using fiberglass reinforced layer and great self-adhesive which can fit closely with non-flat heat sinks to increase the contact area. S282-s is an excellent insulating material with characteristics of low stress damped vibration and shock absorption.
FEATURES
- Thermal conductivity: 2.5 W/m*K
- Designed for manufacturing
- High dielectric breakdown
- Shock and vibration absorber
- Good mechanical strength
- Fiberglass reinforced
TYPICAL APPLICATION
- Flat-panel displays
- LED, HDDs, DVDs
- Heat pipe assemblies
- Memory modules
- Power supplies
- 5G base station & infrastructure
- EV electric vehicle
For more types of products, please refer to the LiPOLY website.
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Our products are also listed on Digikey and Verical
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