LiPOLY Thermal Conductive Sealing Glue
Featured Product from Shiu Li Technology Co., Ltd
LiPOLY DTT58/DTT68 are two-part sealing gap fillers, provide low viscosity and high fluidity. The high deformation material, which can filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the irregular gap.
FEATURES:
- Thermal conductivity:
- DTT58: 1.5W/m*K
- DTT68: 3.0 W/m*K
- Two-parts package and easy to use
- Waterproof and air-tight
- Thermally conductive vibration dampening
TYPICAL APPLICATIONS:
- Automotive electronics
- Telecommunications
- Computer and peripherals
- 5G base station & infrastructure
- EV electric vehicle
For more types of products, please refer to the LiPOLY website.
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Our products are also listed on Digikey and Verical
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