LiPOLY Thermal Conductive Sealing Glue

Featured Product from Shiu Li Technology Co., Ltd

More Info Email Supplier Request a Quote

LiPOLY DTT58/DTT68 are two-part sealing gap fillers, provide low viscosity and high fluidity. The high deformation material, which can filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the irregular gap.

FEATURES:

  • Thermal conductivity:
  • DTT58: 1.5W/m*K
  • DTT68: 3.0 W/m*K
  • Two-parts package and easy to use
  • Waterproof and air-tight
  • Thermally conductive vibration dampening

TYPICAL APPLICATIONS:

  • Automotive electronics
  • Telecommunications
  • Computer and peripherals
  • 5G base station & infrastructure
  • EV electric vehicle

For more types of products, please refer to the LiPOLY website.

By following LinkedIn, you can stay updated with the latest industry and exhibition news.

Our products are also listed on Digikey and Verical