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LiPOLY® Two-Part Thermal Conductive Gap Filler

Featured Product from Shiu Li Technology Co., Ltd

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LiPOLY BS04 is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K, BS04 provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe.

FEATURES

  • Thermal conductivity: 3.6 W/m*K
  • Fast curing in normal atmospheric temperature
  • Great reliability
  • Great sealing in low pressure

TYPICAL APPLICATION

  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware
  • Electric vehicle& Automotive battery