Silicone Free with Low Density Thermal Gap Filler
Featured Product from Shiu Li Technology Co., Ltd

LiPOLY's NL-putty is a silicone free, low-density gap filling material without low total volatile gas. It is suitable for electronic products and automotive electronic devices.
Its low density and lightweight characteristics improve product performance, reduce production costs, and minimize material usage and energy consumption. It can overcome overflow and drying problems, improve heat conduction, and is suitable for automated dispensing production.
FEATURES
- Lightweight, Low Density
- High flow rate, extrusion rate under 90psi & 60s conditions: 29 g/min
- Bond line thickness:100-1500µm
- Silicone free resin materials
- No vertical flow
- Dispensable for serial manufacture
- For any high compression and low stress application
TYPICAL APPLICATION
- Mobile communication device
- Drone & aircraft
- Sports and leisure electronic products
- Portable computers and tablets, wearable devices
- Portable game consoles, VR devices
Silicone Free Lightweight Thermal Conductive Putty
- NL-putty04-s: 4.0w/m*k
- NL-putty06-s: 6.0w/m*k
- NL-putty10-s: 10.0w/m*k
For more types of products, please refer to the LiPOLY website.
By following LinkedIn, you can stay updated with the latest industry and exhibition news.
More Featured Products