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Silicone Free with Low Density Thermal Gap Filler

Featured Product from Shiu Li Technology Co., Ltd

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LiPOLY's NL-putty is a silicone free, low-density gap filling material without low total volatile gas. It is suitable for electronic products and automotive electronic devices.
Its low density and lightweight characteristics improve product performance, reduce production costs, and minimize material usage and energy consumption. It can overcome overflow and drying problems, improve heat conduction, and is suitable for automated dispensing production.

FEATURES

  • Lightweight, Low Density
  • High flow rate, extrusion rate under 90psi & 60s conditions: 29 g/min
  • Bond line thickness:100-1500µm
  • Silicone free resin materials
  • No vertical flow
  • Dispensable for serial manufacture
  • For any high compression and low stress application

TYPICAL APPLICATION

  • Mobile communication device
  • Drone & aircraft
  • Sports and leisure electronic products
  • Portable computers and tablets, wearable devices
  • Portable game consoles, VR devices

Silicone Free Lightweight Thermal Conductive Putty

For more types of products, please refer to the LiPOLY website.

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