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S-putty5-s, a great alternative to thermal grease

Featured Product from Shiu Li Technology Co., Ltd

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Thermally Conductive S-putty5-s
Thermal Conductive Putty | LiPOLY S-putty5-s is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is 10.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and solve drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease in design gaps under 1.0mm (0.2mm~0.5mm). We highly recommend pairing it with the S-putty5-s Dispensing Robot.

Features

  • Thermal conductivity: 10.0 W/m*K
  • Tolerance filled
  • High compressibility with low stress
  • No vertical flow
  • High reliability
  • Bond Line Thickness: 200-3000μm

 

Applications

  • Notebook computers
  • Heat pipe assemblies
  • TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM

 

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Shiu Li Technology Co., LTD 
Shiu Li Technology Co., LTD has established itself as a world-leading thermal management manufacturer, developing high-performance thermal solutions for product designers around the globe. Selling under its brand LiPOLY,  Shi Li Technology Co. LTD has heavily invested in the development of advanced thermal conductive products for high powered modules. In 2018, Shiu Li Technology LLC was established in the United States to better serve customers in North America and Europe.

Shiu Li Technology has served more than 2000 customers worldwide, delivering thermal solutions in computer manufacturing, data communication, consumer electronics, data centers, military equipment, automotive equipment, lighting, power conversion, and more.