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AMB Alumina copper-clad plate

Featured Product from Suntech Applied Materials (Hefei) Co.,Ltd

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 Alumina base plate is the most cost-effective AMB ceramic base plate with wide sources and the lowest cost, and the most mature process to prepare alumina AMB ceramic copper clad plate.  AMB alumina substrate is mostly used in the field where power density is not high and reliability is not strictly required.The ceramic materials of our ceramic metallized products are 99 alumina ceramic and 92 black alumina ceramic substrate, and the forming method is flow molding, which can become the metallized ceramic substrate.  The metallization method has AMB brazing ceramic copper covering.  Product size precision, small warpage, metal and ceramic bonding force, metal and ceramic joint is dense, better heat dissipation.  Can be used for LED heat dissipation substrate, ceramic packaging, electronic circuit board, etc.