Aluminum nitride (AlN) ceramic stands out as the ultimate solution for applications requiring both exceptional thermal conductivity and robust electrical insulation. Boasting a remarkable thermal conductivity exceeding 170W/m*K and a coefficient of thermal expansion closely mirroring semiconductor silicon, AlN ceramic substrates are the preferred choice for packaging and sub-mounting high-power components. Its versatile applications span power LEDs, high-power ICs, high-voltage inductors, and ceramic printed circuit boards in demanding modules like IGBTs, electronic drivetrains, and power management modules. As the electronics industry continues to advance, AlN ceramic substrates emerge as the key enabler for efficient heat management in cutting-edge, high-power electronic modules.

Key Features & Applications:

• High Thermal Conductivity: Exceeds 170W/m*K for optimal heat dissipation.
• Electrical Insulation: Robust insulating properties for enhanced safety.
• Low Coefficient of Thermal Expansion (CTE): Aligns closely with semiconductor silicon for stability.
• Versatile Applications: Ideal for power LEDs, high-power ICs, high-voltage inductors, IGBT modules, electronic drivetrains, power management modules, and specialty lighting.
• Reliable Performance: Ensures the longevity and efficiency of high-power electronic systems.

Elevate your electronics with AlN ceramic substrates – the pinnacle of thermal management and electrical insulation.