Suntech specializes in designing and manufacturing a wide range of dispensing nozzles tailored for the die bonding process. Our nozzles are engineered for precision and reliability, ensuring consistent performance in high-demand environments.

Key Features:

• Material Options:

  • Versatile Construction: Available in SUS (stainless steel), tungsten, and ceramics, providing options suitable for various applications and operational requirements.

• Compatibility:

  • Widely Used: Our dispensing nozzles are compatible with major die bonding machines, including ESEC (BESI), ASM, and other industry-standard equipment, ensuring seamless integration into your production process.

• Precision Engineering:

  • Accurate Dispensing: Designed to deliver precise amounts of adhesive or bonding material, enhancing the quality and reliability of the bonding process.

• Durability:

  • Long-Lasting Performance: Constructed from robust materials, our nozzles are built to withstand the rigors of industrial use, minimizing downtime and maintenance.

Specifications:

• Material Options:

  • SUS (Stainless Steel)
  • Tungsten
  • Ceramics

• Application:

  • Suitable for die bonding processes in semiconductor manufacturing and other related industries.

• Compatibility:

  • Works with ESEC (BESI), ASM, and various other die bonding machines.

• Design:

  • Engineered for optimal fluid dynamics, ensuring consistent material flow and dispensing accuracy.

Invest in Suntech Dispensing Nozzles for reliable and efficient die bonding solutions that enhance the performance of your production processes!