Key Features of AMB Alumina Copper-Clad Plate:

• Enhanced Thermal Conductivity: Provides superior heat dissipation compared to conventional DBC substrates, improving overall thermal management.
• Superior Copper Layer Bonding: Features excellent bonding between the copper layer and ceramic base, enhancing reliability and performance.
• Lower Thermal Resistance: Achieves lower thermal resistance, contributing to better heat dissipation and device efficiency.
• Cost-Effective Alumina Base Plate: Utilizes alumina, the most cost-effective ceramic material, with a mature manufacturing process for high-quality results.
• Versatile Applications: Suitable for LED heat dissipation substrates, ceramic packaging, electronic circuit boards, and more.

Advantages:

• Improved Performance: Better thermal conductivity and lower thermal resistance lead to more efficient heat management.
• Reliable Bonding: Enhanced copper-ceramic bonding ensures durability and stable performance.
• Cost Efficiency: Alumina-based plates offer a balance of cost and performance, making them a practical choice for many applications.

Disadvantages:

• Limited for High-Power Density: Best suited for applications with lower power density and less stringent reliability requirements.

Product Specifications:

• Materials: 99% alumina ceramic and 92% black alumina ceramic substrates.
• Manufacturing Method: Flow molding with AMB brazing for metallization.
• Precision: High size precision, minimal warpage, and dense metal-ceramic bonding.

Ideal for engineers and manufacturers seeking efficient, reliable, and cost-effective thermal management solutions for electronic devices and circuits.