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Application of AlN in electronics industry

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AlN has the characteristics of high strength, high volume resistivity, high insulation and pressure resistance, thermal expansion coefficient, and good match with silicon. In the field of ceramic electronic substrate and packaging materials in recent years, its performance is far superior to alumina. The relatively low thermal conductivity of Al2O3 makes it difficult to meet the needs of future packaging. The industry needs a more advanced ceramic substrate with higher heat dissipation coefficient.