Suntech Ceramic Capillaries: A Game-Changer in Copper Wire Bonding
Shangde ceramic capillaries are engineered to transform the copper wire bonding process, offering enhanced precision, efficiency, and reliability in semiconductor packaging. With a 95% qualification rate, these capillaries provide engineers with the tools to optimize equipment and parameters for the best possible results.

• Cost Efficiency: Shangde ceramic capillaries provide an affordable solution without compromising performance, ensuring a competitive edge in the market.
• Optimized Bonding Process: Achieve precise control over the copper wire bonding process, improving performance and reliability in your packaging.
• 95% Qualification Rate: Benefit from an outstanding qualification rate, ensuring the highest quality in integrated circuit packaging.
• Versatile Applications: Ideal for multi-level and high-density packaging, making it easier to design advanced and innovative semiconductor devices.

Suntech’s continuous refinement of copper wire bonding processes ensures that engineers can maximize efficiency and quality, positioning the product for widespread use in evolving semiconductor technologies.