Optimize Your Wire Bonding with Ceramic Capillaries
Ceramic capillaries play a crucial role in wire bonding, directly impacting the bonding morphology and functionality. By carefully selecting the right parameters, engineers can ensure reliable and high-performance wire bonds. Below are the key factors that influence wire bonding success:

• Hole Size (H):

  • Small H hole: Poor wire flow and neck breakage, leading to insufficient wire arc height.
  • Large H hole: Golf ball effect, resulting in poor bond quality.

• T (Tip Length):

  • Small T: Short wire length, insufficient tensile strength.
  • Large T: Risk of contact with adjacent wires, affecting bond integrity.

• CD (Capillary Depth):

  • Small CD: Poor wire feeding, affecting ball bonding and bond quality.
  • Large CD: Excessive ball height, which can compromise bond strength.

• FA and OR (Final Angle & Opening Ratio):

  • Small FA and OR: Wire breakage or weak bonding due to insufficient force.
  • Large FA and OR: Insufficient wire compression, reducing welding force and tensile strength.

Conclusion
Selecting the right ceramic capillary parameters is essential for ensuring optimal wire bonding performance. By adjusting these parameters according to your specific needs, you can avoid issues like weak bonding or wire breakage, ultimately improving the success rate of ceramic capillary validation and enhancing your production process.