Optimal Performance for Wire Bonding

Our wedge capillary tools are engineered to ensure high-quality wire bonding across diverse applications. Essential for precise and reliable connections, these tools are available in multiple materials and configurations to suit various packaging requirements.

Key Features:

• Versatile Material Options: Choose from tungsten carbide, titanium carbide, or ceramic to match the demands of your bonding process and wire material.
• Customizable Head Structures: The wedge-shaped head can be tailored to fit different solder joint sizes and appearances, ensuring compatibility with various packaging designs.
• Precise Through-Hole Design: The through-hole on the back is sized according to wire diameter, facilitating accurate wire passage and enhancing bonding quality.
• Enhanced Bonding Quality: The structure of the wedge capillary impacts the overall bonding performance. Factors such as pad size, spacing, welding depth, lead diameter, and wire hardness are carefully considered to optimize bonding results.

Applications:

• Semiconductor Packaging: Ideal for high-precision wire bonding in semiconductor applications, ensuring robust and reliable electrical connections.
• Electronics Manufacturing: Perfect for use in the electronics industry, where consistent and precise wire bonding is crucial for product reliability and performance.
• Custom Applications: Tailored solutions for unique bonding requirements, accommodating various sizes and configurations to meet specific industry needs.

Upgrade your wire bonding process with our advanced wedge capillary tools, designed to deliver exceptional quality and performance for all your critical applications.