MSP's New Automated Particle Deposition System

Featured Product from TSI Incorporated

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MSP's fully automated particle deposition system deposits PSL and SiO2 spheres. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer handling allows up to 25 wafers to be processed in a single control job, increasing productivity in your metrology operations and improving product yield.

The Model 2300G3A Particle Deposition System offers best-in-class performance for deposition of particle size standards (including MSP NanoSilica™ Size Standards) on bare, film, and patterned wafers. Using advanced particle generation and Differential Mobility Analyzer (DMA) technology, the 2300G3A controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability for demanding metrology applications in semiconductor manufacturing. With the capacity for 16 particle suspensions and a DMA-mode operating range of 20nm to 2µm, virtually any inspection tool calibration curve can be generated via deposition with a single automated recipe.

APPLICATIONS

  • Traceable inspection system calibration
  • Matching legacy wafer calibration standards
  • Incoming bare wafer inspection/qualification
  • Determining inspection sensitivity for proprietary films
  • Blanket film monitoring
  • Inspection tool development and qualification
  • Process tool qualification, process learning and monitoring