MSP's New Automated Particle Deposition System
Featured Product from TSI Incorporated
MSP's fully automated particle deposition system deposits PSL and SiO2 spheres. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer handling allows up to 25 wafers to be processed in a single control job, increasing productivity in your metrology operations and improving product yield.
The Model 2300G3A Particle Deposition System offers best-in-class performance for deposition of particle size standards (including MSP NanoSilica™ Size Standards) on bare, film, and patterned wafers. Using advanced particle generation and Differential Mobility Analyzer (DMA) technology, the 2300G3A controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability for demanding metrology applications in semiconductor manufacturing. With the capacity for 16 particle suspensions and a DMA-mode operating range of 20nm to 2µm, virtually any inspection tool calibration curve can be generated via deposition with a single automated recipe.
- Traceable inspection system calibration
- Matching legacy wafer calibration standards
- Incoming bare wafer inspection/qualification
- Determining inspection sensitivity for proprietary films
- Blanket film monitoring
- Inspection tool development and qualification
- Process tool qualification, process learning and monitoring