- Trained on our vast library of engineering resources.

TechInsights Teardown: Apple iPhone 15

Service Detail from TechInsights Inc.

More Info Email Supplier Request a Quote

Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Learn more about the Apple iPhone 15 smartphone teardown here.

The popularity of the Apple iPhone is only growing. In fact, recently it was revealed the iOS device reached record levels in 2023 and attained the top spot in the Chinese smartphone market for the first time.

The device is also becoming more powerful with the hexa-core 64-bit Apple applications processor embedded as the main engine inside the portable device. It also boasts 6 GB mobile SDRAM from SK Hynix in the standard edition and even more in the Pro series.

The following is a partial deep dive into the latest smartphone from Apple conducted by TechInsights.

Summary

  • 6.14 inch AMOLED
  • 6 GB mobile LPDDR5 SDRAM
  • 12 MP camera
  • 1.4 MP IR camera
  • 48 MP wide-angle camera

Released: September 2023

Availability: Worldwide

Price: $890

Main board

The main board houses the primary applications processor for the Apple iPhone 15, the 64-bit hexa-core A16, and the main memory, the SK Hynix 6 GB mobile LPDDR5X SDRAM. Other electronic components include:

  • Skyworks’ RxD front-end module, quad-band GSM power amplifier
  • Broadcom’s HB and MB front-end module
  • Samsung’s display power management
  • Murata’s 2.4 GHz Wi-Fi front-end module
  • Bosch Sensortec’s six-axis MEMS accelerometer and gyroscope
  • Apple’s audio amplifier
  • USI’s UWB module
  • Onsemi’s 600 mA synchronous boost regulator
  • ST Microelectronics’ camera power management
  • NXP Semiconductors’ NFC controller
  • Texas Instruments’ Flash LED driver

(Learn more about MEMS devices on Globalspec.com)

USB connector flex

The USB board contains several electronic components needed in operation of external connections to the smartphone. The board contains mainly RF tuner ICs from Qorvo.

(Learn more about RF chips on Globalspec.com)

RF board

The RF board inside the Apple iPhone 15 contains the communication systems for Bluetooth, Wi-Fi and 5G operations for the smartphone. The main electronic components include:

  • Broadcom’s FBAR filter, RF switch, RF LNA and diplexer
  • ST Microelectronics’ serial EEPROM memory
  • Qorvo’s GPIO interface and 5G average power tracker
  • Qualcomm’s Snapdragon X70 5G modem with memory, clock buffer and RF transceiver
  • USI’s Wi-Fi 6E/Bluetooth IC
  • Skyworks’ RxD front-end module and RF switch
  • Murata’s RxD front-end module and RF switch
  • Analog Devices’ engine driver
  • Apple’s audio amplifier

(Learn more about power management ICs on Globalspec.com)

Major components

  • $71.33 — 64-bit hexa-core applications processor — Apple (Qty: 1)
  • $46.40 — 48 MP wide-angle rear camera subsystem (Qty: 1)
  • $46.00 — Super retina display/touchscreen subsystem — Samsung (Qty: 1)
  • $25.42 — Snapdragon X70 5G modem with memory — Qualcomm (Qty: 1)
  • $21.67 — Main enclosure (Qty: 1)
  • $16.30 — 12 MP ultra-wide-angle rear camera subsystem (Qty: 1)
  • $13.14 — Back cover
  • $12.88 — 12 MP front camera subsystem — Foxconn (Qty: 1)
  • $11.22 — RF transceiver GPS — Qualcomm (Qty: 2)
  • $11.02 — IR camera/dot projector subsystem (Qty: 1)