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TechInsights Teardown: Google Pixel Fold

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Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Learn more about the Google Pixel Fold smartphone teardown here.

While still considered a niche sector, foldable phones are growing not just in number but in popularity among consumers.

The key to foldable smartphones is the ability to carry or use them as a traditional mobile device but then be able to fold it open to a much larger screen for watching movies or streaming. Then when done watching the movie, it folds back to be able to put in a pocket or backpack.

Nearly all telecoms have some type of foldable phone available and mobile handset vendors seem to be committed to rolling these out on a regular yearly basis. In fact, Google has been rumored to release its Google Pixel Fold 2 in the coming months.

The Google Pixel Fold was released last year and billed as having the same features as the Google Pixel but with this ability to fold into a larger device. The Google Pixel Fold is a standard 5.8 inch display but then folds into a 7.6 inch display.

The device includes Googles Tensor G2 applications processor, its proprietary device it looks to compete with Apple and Samsung in the smartphone market. It also has Google’s Titan M2 security processor for encryption and security.

The following is a partial deep dive into the Google Pixel Fold conducted by TechInsights.


  • 7.6 inch AMOLED
  • 8 MP main camera
  • 58 MP wide-angle camera

Price: $1,799

Availability: Worldwide

Target market: Consumer, communications

Released: June 2023

Main board

The main board is the brains and heart of the Google Pixel Fold smartphone with the main applications processor the Google Tensor G2 and 256 GB 3D TLC NAND flash memory and 12 GB mobile LPDDR5 SDRAM from Micron Technology. Other electronic components on the board include:

  • Samsung’s 5G NR baseband processor, 5G transceiver, clock buffer and Wi-Fi 6e/Bluetooth module
  • Qorvo’s RF antenna tuner
  • Qualcomm’s SAW filter
  • Nexperia’s Dual two-input AND gate
  • Google’s Titan M2 security processor
  • NXP Semiconductor’s SIM card interface
  • Texas Instruments’ 1.5-amp dual LED flash driver and hall effect sensor
  • Analog Devices’ 4.4-amp buck boost DC-DC converter
  • Torex Semiconductor’s LDO regulator
  • Silicon Mitus’ display power management IC
  • Renesas’ power management IC
  • Broadcom’s dual frequency GPS receiver with sensor hub
  • Murata’s saw filters

(Learn more about microprocessors and microcontrollers on Globalspec.com)

5G mmWave board

The mmWave board contains components needed to connect to mmWave frequencies on the Google Pixel Fold. Electronic components on this board include Murata’s 5G RF transceivers and Samsung’s power management ICs.

(Learn more about networking chips on Globalspec.com)

Sim board

The sim board includes some of the RF and sensors needed for the Google Pixel Fold smartphone. Electronic components on this board include:

  • A display power management IC from Samsung
  • RF antenna tuner from Qorvo
  • A six-axis MEMS accelerometer and gyroscope from ST Microelectronics
  • 1.5 amp step-down converter from Analog Devices

(Learn more about MEMS devices on Globalspec.com)

Major components

  • $123.90 — 120 Hz main display/touchscreen subsystem — Samsung (Qty: 1)
  • $90.00 — Octa-core Google Tensor G2 applications processor — Google (Qty: 1)
  • $38.54 — 48 MP wide-angle rear camera subsystem (Qty: 1)
  • $28.75 — 120 Hz secondary display/touchscreen subsystem — Samsung (Qty: 1)
  • $23.48 — 10.8 MP telephoto rear camera subsystem — (Qty: 1)
  • $19.77 — 12 GB mobile LPDDR5 SDRAM — Micron (Qty: 1)
  • $17.29 — 5G mmWave subsystem — Murata
  • $15.90 — 5G NR baseband processor with memory — Samsung (Qty: 1)
  • $15.11 — 256 GB 3D TLC NAND flash — Micron (Qty: 1)
  • $14.90 — 10.8 Ultra-wide rear camera subsystem (Qty: 1)