Wafer-Level-Packaging for LWIR Imaging Platform
Featured Product from Teledyne DALSA
Teledyne DALSA Introduces Wafer-Level-Packagin
Waterloo, Canada - August 31, 2017 - Teledyne DALSA, a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its Wafer-Level-Packaged
Teledyne DALSA's Wafer-Level-Packaged
Teledyne DALSA's small form factor and lightweight, Calibir DX series can be integrated in tight spaces for compact and low profile solutions. Remarkable shutterless calibration and operation sets them apart in the industry and allows them to run uninterrupted for long periods of time-a clear advantage in critical imaging situations. Cameras and cores support a variety of interfaces, lenses, image processing features and hardware options that serve a wide range of uncooled LWIR thermal imaging applications, including UAV systems for agriculture, construction, defense, mapping and surveying, and oil and gas. The series architecture lends itself easily to customization of cameras and cores, with options including wafer level packaged devices, smart embedded algorithms, and the industry's first proven real-time fusion imaging.
In addition, the company will display its multi-featured Genie Nano camera series. Low-cost, with a small form factor, Genie Nano models are available in a wide range of resolutions, from VGA to 25Megapixel, and with a variety of interface options. Genie Nano models are built around the industry's most powerful image sensors and housed in a rugged and robust housing. Lightweight, power-efficient and compact, they are appropriate solutions for applications enabled by Unmanned Aerial Vehicles (UAV).
Royal Victoria Dock, 1 Western Gateway, London, UK
Tuesday, September 12 - Friday, September 15, 2017
Export Control and Controlled Goods
Teledyne DALSA solutions are subject to Canadian export controls. Teledyne DALSA design controls are compliant to the relevant MIL-standards.
About Teledyne DALSA's Image Sensors
Aside from Uncooled LWIR capabilities, Teledyne DALSA designs and manufactures high performance CCD and CMOS image sensors for a wide range of digital imaging applications, including professional photography, industrial inspection, radiography, aerospace, and defense and security. Decades of research and development have earned us dozens of patents in the design and fabrication of image sensors, allowing us to continually refine our products into the best-performing devices available today. For more information, visit www.teledynedalsa.co
About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada. For more information, visit www.teledynedalsa.co
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Teledyne DALSA reserves the right to make changes at any time without notice.