Breakthrough in IC Thermal Characterization
Featured Product from Thermonics Corp., an inTEST Company
Proprietary technology removes performance degrading TE Modules when thermal cycling.
Most direct contact temperature systems on the market today use thermoelectric or Peltier cooling to move the DUT to temperature. Thermoelectric (TE) modules in these systems are most reliable in applications involving relatively steady-state cooling where DC power is being applied to the module on more-or-less continuous and uniform basis. However, fatigue and degradation or failure rates of TE modules are likely to occur with large temperature changes and frequent thermal cycling. Not so with Temptronic's ThermoSpot® direct contact temperature control system. It eliminates the need for a TE module.