AlN Aluminum Nitride Ceramic Sheet Plate Substrate
Featured Product from Xiamen Unipretec Ceramic Technology Co., Ltd.
Aluminium nitride has the highest thermal conductivity of any ceramic material, on a par with most metals; however it also provides electrical insulation. This makes it the top-of-the-range choice for the most demanding of heat sink applications.
It is stable up to 1000oC (1800°F) in air and 1900oC (3450°F) in inert atmospheres. The thermal expansion coefficient is lower than that of common heat sink materials such as aluminium and alumina. The thermal expansion coefficient is a close match to the expansion of common semiconductor substrate materials, making it ideal for the mounting of large semiconductor devices.
Aluminium Nitride is the very best ceramic commercially available for heat sink applications. It is often used in microelectronics, lighting, power, optics and the ever growing field of renewable energy.