Key Features of Aluminum Nitride Ceramics:

• Superior Thermal Conductivity: Thermal conductivity up to 230W/m.k, ideal for efficient heat dissipation in high-power applications.
• Electrical Insulation: High electrical insulation properties, making AlN suitable for electronic packaging and circuit boards.
• High Mechanical Strength & Toughness: Robust against mechanical stresses, providing long-term reliability in harsh environments.
• Environmental Safety: Non-toxic and eco-friendly, meeting EU environmental protection standards.
• Tailored Specifications: Available in a variety of sizes, thicknesses, and customized specifications to meet customer needs.

Applications:

• Electronics Industry: Substrates for LED modules, RF resistors, and IGBT power modules.
• Heat Dissipation: Ideal for heat-dissipating substrates in compact and high-power devices.
• Packaging & Circuitry: Used in thin film, thick film, DPC, DBC, and AMB processes.
• Laser Devices: High thermal conductivity variants are extensively used in laser systems.

Aluminum Nitride Ceramic Products:

• Tape Casting Substrates: Offers high production efficiency, standard thermal conductivity ≥170W/m.k, and customizable thickness (0.25 to 1.0mm).
• Dry Pressed Substrates: Achieve high mechanical strength and toughness, available in sizes up to 450mm with thicknesses ranging from 1.5mm to 20mm.
• High Thermal Conductivity Variants (200W/m.k & 230W/m.k): Specially designed for applications requiring superior heat dissipation, such as laser devices.

Additional Services:

• Grinding & Polishing: Achieve smooth, flat surfaces with surface roughness as fine as Ra0.03-0.05, perfect for delicate wiring and thin film circuits.
• Laser Processing: Customizable to meet exact dimensional tolerances (±0.03-0.15mm) for specialized shapes and metal circuit creation.