Temperature chambers capable of long dwell times and wide temperature ranges (-55 to 500°C) for Electro/Stress Migration, Time Dependent Dielectric Breakdown, and Hot Carrier / Vt Stability Tests. Designed with card cages, card-slots, and access doors to simplify connecting DUT boards and driver boards with ATE test setups. Equipped with a programmable, touch-screen controller delivering 1.0°C accuracy.

Benefits:

• High capacity testing, up to 60 load boards or hundreds of DUTs
• Change DUTs without removing driver boards and test connections
• Connect driver boards easily with slotted  pull-off door
• Reduce condensation with dry air purge
• Maintain uniform air flow regardless of how many boards in chamber
• Communicate remotely - IEEE, RS232, Ethernet

What are your burn-in requirements?
See more burn-in chambers and chamber configurations.