Our Package Conversion Adapters are an economical alternative to costly board redesign when IC device packages are discontinued or transitioned to newer designs such as finer pitch, lead-free, or surface mount packages. Customized solutions often reduce overall costs by combining or adding functionality, providing improved processing or testing capability by increasing pitch (fan-out), u... Read more...
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BGA, LGA, or QFP to QFP footprint on the PCB
Advanced's proprietary Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or different footprint. Read more...
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Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC devices. Standard and lead-free designs featuring screw-machined terminals. Read more...
More Product Announcements from Advanced Interconnections Corp.