2.00mm Pitch Connectors for High Reliability Applications Read more...More Product Announcements from RS Components, Ltd.
Featuring a 1.25 mm pitch with four header options, Molex’s best-selling PicoBlade wire-to-board and wire-to-wire connector system is now available with gold plating. Read more...More Product Announcements from Heilind Electronics, Inc.
Our Sliver internal cabled interconnect system provides a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. With a 0.6mm contact pitch, Sliver products are super slim, allowing you to fit more inside the box. Read more...More Product Announcements from TE Connectivity
QSFP-DD doubles the density of QSFP interconnects with an eight-lane electrical interface capable of 28 Gbps NRZ or 56 Gbps PAM-4 to achieve 200 or 400 Gbps aggregate per port. Our QSFP-DD cages feature a proprietary heat sink design, making them the only solution to work in 15-18W applications at a low cost – providing superior thermal and signal integrity performance. Read more...More Product Announcements from TE Connectivity
Our broad portfolio of small form-factor pluggable (SFP) I/O interconnects was developed to offer flexible, cost effective solutions to meet your design requirements. Each of the products in our SFP portfolio of I/O interconnects is designed to transfer data at speeds of up to 28 gigabits per second (Gbps) NRZ and 56 Gbps PAM-4. Read more...More Product Announcements from TE Connectivity
With 16 channels of up to 28 Gbps data rates for 400 Gbps total bandwidth, CDFP connectors, cage and cable assemblies can easily handle the market’s increasing data usage. The simple one-piece, press-fit pluggable I/O assembly provides the flexibility and standardization to address your design needs and is perfect for high speed networking and high-performance computing applications. Read more...More Product Announcements from TE Connectivity
TE’s OSFP connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200G and up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. Read more...More Product Announcements from TE Connectivity
Omnetics Connector Corporation's high reliability Micro-D connectors are now available with mixed power/signal contact layouts to allow designers the ability to achieve their optimal layout and performance. Read more...More Product Announcements from Omnetics Connector Corporation
Lower your connection costs with Phoenix Contact SKEDD Connectors.
Simplify wire to PCB connection and reduce your component count. New SKEDD one-piece PCB connector technology makes direct-to board connection a simple, reliable reality.
They push in and lock directly to the PCB via through-contacted bore holes. The need for a separate header is therefore eliminated... Read more...More Product Announcements from RS Components, Ltd.