Boyd Corporation

Flat Tube Liquid Cold Plates

Low thermal resistance liquid cold plates in a compact, low profile Read more...

More Product Announcements from Boyd Corporation
Boyd Corporation

Extended Surface Liquid Cold Plates

Drastically increase heat transfer with additional surface area within the flow path of a liquid cold plate. Read more...

More Product Announcements from Boyd Corporation
Hermetic Solutions Group

The Hermetic Solution Group’s DiaCool materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal conductivity that can satisfy the most demanding high power density applications. Our DiaCool materials exhibit excellent surface quality for all your die attach and soldering needs. Read more...

More Product Announcements from Hermetic Solutions Group
MINTEQ® International Inc, Pyrogenics Group

Discover how the heat spreading ability of a new material solution - Pyroid® HT ® cuts size, weight, and cost from electronics packaging. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
MINTEQ® International Inc, Pyrogenics Group

Heat is the enemy of electronic circuits and devices. It limits performance and leads to premature failure. We are introducing a new weapon in the ongoing battle against thermal problems. Discover how the heat spreading ability of a new material solution — Pyroid® HT®... cuts size, weight, and cost from electronics packaging. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Boyd Corporation

From small stamped aluminum parts for cooling discrete semiconductors at the board level to extremely large thermal systems utilizing large advanced fin types and unique geometries, Aavid, thermal division of Boyd Corporation is the industry leader in heat sink design and manufacture. Read more...

More Product Announcements from Boyd Corporation
Ohmite Manufacturing Co.

The CA series is a ceramic heatsink capable of handling two devices. This dual ceramic heatsink utilizes the same patented cam lock clips used in many Ohmite heatsinks. Read more...

More Product Announcements from Ohmite Manufacturing Co.
Ohmite Manufacturing Co.

The P series heatsink from Ohmite uses Forged Pin technology to increase the surface area for greater free air convection. Forced air convection applications will benefit from the ability to force air in multiple directions through the pins. Read more...

More Product Announcements from Ohmite Manufacturing Co.
MINTEQ® International Inc, Pyrogenics Group

With heat issues limiting power device performance and growth, we have developed a derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group