- Trained on our vast library of engineering resources.
Boyd

Boyd Hi-Contact™ Tube Liquid Cold Plate

Liquid Cold Plates with Optimized Surface Contact Read more...

More Product Announcements from Boyd
Boyd

Liquid Cooling offers highly efficient thermal management for high heat loads. Try Boyd's quick and easy tool for determining the best cold plate for your application requirements. Read more...

More Product Announcements from Boyd
Boyd

Flat Tube Liquid Cold Plates

Low thermal resistance liquid cold plates in a compact, low profile form factor. Read more...

More Product Announcements from Boyd
Boyd

Extended Surface Liquid Cold Plates

Drastically increase heat transfer with additional surface area within the flow path of a liquid cold plate. Read more...

More Product Announcements from Boyd
Boyd

Zipper fins heat sinks are a great heat transfer solution. While Genie uses them in the simplest form, zipper fins have a wide range of application and design flexibility. Contact Boyd Design Engineers for assistance with your zipper fin heat sink design. Read more...

More Product Announcements from Boyd
Rego Electronics Inc.

In order to better satisfy our customers’ demand, it’s pleased to introduce you the latest Cooler series for AMD EPYC™ Embedded 3000 Processors: Read more...

More Product Announcements from Rego Electronics Inc.
Rego Electronics Inc.

Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. Read more...

More Product Announcements from Rego Electronics Inc.