Product Announcements:
Reed Relays

These highly reliable relays are ideal for high-density switching matrices used in Automated Test Equipment (ATE) and data acquisition systems. Read more...

Small footprint and high reliability Read more...

40% Smaller footprint than the Industry standard SIP series Read more...

The Comus Group of Companies and Bright Toward Taiwan are proud to offer the 38-Q Series of PhotoDMOS relays with AEC-Q101 Certification for Automotive applications. Read more...

Ideal for instrumentation, automatic test equipment and high density switching matrices, the Comus' new 14 series is a high reliability instrumentation grade Mini-Sip package. With switch power ratings up to 15W, our new relay series offers a 50% increase over industry standard packages Read more...

Comus International is proud to introduce the 1517 series Ultra Mini SIP reed relay with a PCB footprint 75% smaller than the industry standard SIP relay. Read more...

Comus International is proud to introduce the BFH series of high reliability instrumentation grade multi-pole reed relays. The 2 Form A, 3 Form A and 2 Form C configurations are ideal for use in new high contact density load board designs used in automatic test equipment. Read more...

The new CGSM series offers superior reliability for the Instrumentation and automatic test equipment markets. With contact ratings up to 10 Watts and a 1 Amp carry current our new relay boasts an impressive 50% increase in power and capability over any similar size industry standard SMD packages presently being offered today. Read more...

The 1411 (10 watt) and 1419 (15 watt) are high reliability instrumentation grade Mini-Sip packages targeted for instrumentation, automatic test equipment and high density switching matrices. Read more...