Suntech Advanced Ceramics (Shenzhen) Co., Ltd

Special characteristics and advantages of Suntech advanced ceramics

Product application

Because the excellent special characteristics of advanced ceramics. Super pure ceramics usually apply to the cycle of semiconductor manufacture, include semiconductor chip and chip handling, semiconductor manufacture(front-end) and semiconductor package(behind-end).... Read more...

More Product Announcements from Suntech Advanced Ceramics (Shenzhen) Co., Ltd
Suntech Advanced Ceramics (Shenzhen) Co., Ltd

Wire bonding is to weld the two ends of the lead to chip pad and the lead frame respectively by means of thermal ultrasonic pressure, so as to realize the connection between the internal circuit and the external circuit of the chip. The lead metal materials mainly include gold, silver, alloy, copper wire, etc. The reliability and cost advantages of copper wire are highly concerned by the... Read more...

More Product Announcements from Suntech Advanced Ceramics (Shenzhen) Co., Ltd
Suntech Advanced Ceramics (Shenzhen) Co., Ltd

Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding according to the shape of the welded solder joints. Read more...

More Product Announcements from Suntech Advanced Ceramics (Shenzhen) Co., Ltd