Palomar Technologies, Inc

Replace your Palomar 2460/6000/8000 with the most technologically advanced fine wire ball bonder: the Palomar 8100 Wire Bonder.

For making interconnects between an integrated circuit (IC) and to other electronics or a PCB, there is nothing more cost-effective and flexible than using a fine wire ball bonder. Read more...

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Palomar Technologies, Inc

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area. Read more...

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Palomar Technologies, Inc

From Prototype to Production for Biophotonics & Medical Device Packaging Assembly

The medical device market is expected to significantly diversify and almost double in value to $90 billion by 2025, but vendors face significant cost and packaging challenges if they are to successfully exploit these opportunities. Learn more about the advanced development protocols drawn... Read more...

More Product Announcements from Palomar Technologies, Inc
Palomar Technologies, Inc

Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. Specifically, the interconnect methods can include conductive epoxy, solder paste, sintered paste, eutectic preforms, wire bonding, flip-chip with ball bumps, etc., which all require different technologies and equipment. Read more...

More Product Announcements from Palomar Technologies, Inc
Palomar Technologies, Inc

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders. Read more...

More Product Announcements from Palomar Technologies, Inc
Palomar Technologies, Inc

Palomar Technologies today announced the availability of their new Palomar 8100 Wire Bonder. The new 8100 wire bonder is a fully automated, thermosonic high-speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design, the Palomar 8100 incorporates the latest productivity technology and operator ergonomics. Read more...

More Product Announcements from Palomar Technologies, Inc