Product Announcements:
Semiconductor Wire and Wedge Bonders

Unlock the potential of copper wire bonding with Shangde ceramic capillaries - a game-changer in semiconductor packaging. Optimize processes, enhance reliability, and cut costs, achieving a remarkable 95% qualification rate. Read more...

Understanding capillary aging in wire bonding, its impact on solder joint quality, and methods to mitigate deterioration for prolonged capillary life. Read more...

Special characteristics and advantages of Suntech advanced ceramics

Product application

Because the excellent special characteristics of advanced ceramics. Super pure ceramics usually apply to the cycle of semiconductor manufacture, include semiconductor chip and chip handling, semiconductor manufacture(front-end) and semiconductor package(behind-end).... Read more...

Elevate your wire bonding precision with our advanced wedge capillary tools, designed for superior performance with customizable heads and various material options to meet your packaging needs. Read more...

Enhancing Soldering Quality with Wedge Capillaries Read more...

Ceramic capillaries are the primary tools used for wire bonding. Under the influence of pressure, heat, and ultrasonic vibration, these capillaries are used to bond wires with diameters ranging from 0.025mm to 0.050mm onto solder pads or pins. Read more...

In order to achieve more efficient and reliable bonding with silver alloy wire, the specially treated texture of Suntech ceramic capillary is recommended, which has been proven to enhance the coupling interface between the capillary tip surface and the silver alloy wire, providing more efficient ultrasonic energy transfer. Read more...