Palomar Technologies, Inc

Join Palomar Technologies live at SEMICON West 2022 from July 12 – 14, 2022 in San Francisco. Visit us at booth 1546 and find out more about the newly released, highly flexible Palomar 3880-II Die Bonder. Read more...

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Palomar Technologies, Inc

In the world of automated semiconductor packaging, units-per-hour (UPH) and throughput are not just simple functions of any one machine’s axis speed – rather they are the result of a much more complicated formula used to calculate the return on investment of semiconductor packaging equipment. Read more...

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Palomar Technologies, Inc

The next few years hold out sensor opportunities concomitant to the spectacular growth in global robotics. One of the key drivers for the latter is logistics; from small to large scale, from warehouses measured by the square meter, to airports measured by the square mile. It is within these arenas that the most advanced sensor device development is taking place... Read more...

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Palomar Technologies, Inc

The market for the IR sensing devices has been growing steadily, but in recent years, the market experienced a rapid growth. Several factors drove the market. Among them, the sharp increase in the need for surveillance cameras and, with COVID-19, remote temperature sensing. The growth of smart building technology added more demand for IR sensors as well. Read more...

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Palomar Technologies, Inc

The new Palomar 3880-II die bonder is based on Palomar’s proven 3880 die bonder design but now includes options to even further maximize productivity, reduce programming time by up to 95% and improve the overall bonder productivity. Read more...

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Palomar Technologies, Inc

The production of RF power amplifiers necessitates both high volume and high quality. In general, finding a balance between maximizing throughput and meeting the required performance metrics, such as thermal conductivity of the bond between the die and package is crucial in any application, but is especially important in markets with growing demand. Read more...

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Palomar Technologies, Inc

The photonics market is continuing to explode with a new report showing that just the European photonics market is growing at double the rate of global GDP – outperforming EU GDP and EU industrial production by three to five times, respectively*. Read more...

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Palomar Technologies, Inc

The Palomar 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the 3880’s versatility includes both eutectic & epoxy die attach, flip chip, and a range of options. Read more...

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Palomar Technologies, Inc

Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder. Read more...

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Palomar Technologies, Inc

When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die bonding systems require some type of vision processing for the machine to accurately locate the component before picking and placing the part. Read more...

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