Palomar Technologies, Inc

WEBINAR: Process Control & Traceability for Military and High Reliability Semiconductor Applications

Automated packaging for aerospace and defense necessitates high reliability as the final assemblies will either need to function in the harshest environments or play critical roles where failure is not an option. Read more...

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Palomar Technologies, Inc

WEBINAR: The journey to full-scale semiconductor packaging: Part 2: Process Optimization Challenges of Semiconductor Manufacturing.

The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles. Read more...

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Palomar Technologies, Inc

The Palomar 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the 3880’s versatility includes both eutectic & epoxy die attach, flip chip, and a range of options. Read more...

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Palomar Technologies, Inc

With COVID-19, the growth of IR sensors used to measure heat as well as detect motion has exploded. IR imagers and detectors are used in a myriad of applications, from gas & fire detection to motion detection as well as temperature measurement, with the biggest growing market being smart buildings and people counting for retails. Read more...

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Palomar Technologies, Inc

Join Palomar Technologies Product Marketing Manager, Kyle Schaefer for his presentation at the Components for Military and Space Electronics virtual exposition from April 19 – 22, 2021.

Kyle will present: The Necessity of Process Control, Traceability, and Automation in Manufacturing Aerospace and Defense Assemblies at 1:15pm PST on Tuesday, April 19. Read more...

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Palomar Technologies, Inc

Much of the semiconductor packaging industry is engaged in an exciting and growing photonics ecosystem. The associated challenges of photonics packaging, specifically relating to optical transceivers, include meeting anticipated performance gains while squeezing large package functionality into smaller, more thermally efficient footprints. Read more...

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Palomar Technologies, Inc

WEBINAR: Balancing Throughput and Process Control for Manufacturing of RF Power Amplifier Assemblies

The production of RF power amplifiers necessitates both high volume and high quality. Understanding the tools available to mitigate failures and protect against material inconsistencies is a necessary step in finding a balance between throughput and yield. In this webinar, we will... Read more...

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Palomar Technologies, Inc

Martyn Davies, New Business Development from Palomar Technologies UK, will present: "Die Bond Flexibility for Next Generation Photonic Packaging."

Meet Palomar Technologies at Photonics+ Virtual Conference and Exhibition on February 17 & 18th, 2021. PHOTONICS+ Virtual Exhibition and Conference, in partnership with EPIC, is the new digital live event for the photonics industry. Read more...

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Palomar Technologies, Inc

WEBINAR: The journey to full-scale semiconductor packaging: Part 1: Manufacturability Challenges of Semiconductor Packages for Start-ups

The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing... Read more...

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Palomar Technologies, Inc

Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder. Read more...

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