Palomar Technologies, Inc

WEBINAR: Successful Void-Free Die Attach using Vacuum Reflow Systems

There are many factors to consider when it comes to achieving desirable die attach and lid seal bonding; one of the most important of these factors is solder interface voiding. Voids in the solder interface contribute to various failure modes including overheating via non-uniform dissipation of heat and high mech... Read more...

More Product Announcements from Palomar Technologies, Inc
Palomar Technologies, Inc

Electric power stands at the center of the ecopower revolution, and at the center of the center stands the power module. Within this particular ecosystem, two principle types dominate power modules: the metal–oxide–semiconductor field-effect transistor or MOSFET power module and the insulated-gate bipolar transistor or IGBT power module. Read more...

More Product Announcements from Palomar Technologies, Inc
Palomar Technologies, Inc

The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. Read more...

More Product Announcements from Palomar Technologies, Inc
Palomar Technologies, Inc

The SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Read more...

More Product Announcements from Palomar Technologies, Inc