MTI Instruments Inc.

Thickness and Bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape

The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. Read more...

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Zygo Corporation

ZMI™ lasers provide frequency stabilized, two-frequency output to drive multiple measurement axes. The small ZMI™ 7705 is used with the ZMI™ 501A measurement enclosure to provide two axes of measurement. The larger lasers include features such as more power (7702), water cooling (7714), and separate laser source and delivery modules (7722/7724). Read more...

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