Palomar Technologies, Inc

The SST 3190 and 3180 are high vacuum wafer bonders capable of wafer sizes to 6-inch (150 mm) diameter that provides precise automatic control of heating and cooling at temperatures up to 500°C (1000°C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. Read more...

More Product Announcements from Palomar Technologies, Inc
Zygo Corporation

Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom orders. Read more...

More Product Announcements from Zygo Corporation