HORIBA Instruments, Inc.

The IR-400 offers real-time monitoring of the chamber cleaning end point during the deposition process. By optimizing the cleaning process, the IR-400 reduces cleaning time and gas usage. Reduction in cleaning gas usage means a reduction in chamber damage and increases the life span of systems components. Read more...

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HORIBA Instruments, Inc.

The MICROPOLE system is one of the smallest complete mass spectrometer systems. The compact size is achieved using a patented array design of miniature quadrupole mass filters. Read more...

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Palomar Technologies, Inc

The SST 3190 and 3180 are high vacuum wafer bonders capable of wafer sizes to 6-inch (150 mm) diameter that provides precise automatic control of heating and cooling at temperatures up to 500°C (1000°C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. Read more...

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Zygo Corporation

Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom orders. Read more...

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