Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. Read more...More Product Announcements from Indium Corporation
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.
The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... Read more...More Product Announcements from MacDermid Alpha Electronics Solutions
With the vast amount of electronics now in our cars & trucks, ensuring the performance of those systems is vital. Indium has proven their commitment to supplying the best, high-reliability materials & products for vehicle applications by achieving IATF 16949, meeting the highest standard for automotive industry Read more...More Product Announcements from Indium Corporation
One of the key hurdles in product development is being able to test a variety of options at a reasonable cost. With our Solder Ribbon Selector Kits you can select various assembly solders to experiment with, then choose the one that works best in your application. Read more...More Product Announcements from Indium Corporation
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). Read more...More Product Announcements from MacDermid Alpha Electronics Solutions
ALPHA® PowerBond® Solder Preforms are based on a family of lead-free, high-reliability alloys with Antimony (Sb) content ranging from 5-10%. They are well suited for automotive and power semiconductor applications. Read more...More Product Announcements from MacDermid Alpha Electronics Solutions
Non-Eutectic, Low Temperature, Pin Testable, Solder Paste for
Motherboard Assemblies with High Warpage Chips Read more...
Void reduction is complex. A number of factors contribute to void generation, so in order to address this common problem, Alpha is focused on understanding all the variables. Read more...More Product Announcements from MacDermid Alpha Electronics Solutions
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Read more...More Product Announcements from MacDermid Alpha Electronics Solutions
No other metal is as versatile as indium metal. In its various forms it is used for:
- Sealing in cryogenic applications - stays malleable and ductile below -150°C
- Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C
- High-end device cooling - reduces operating temperatures by up to 10°C