Industrial coatings to provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the customers in process protection, product high-precision bonding, and electrical performance. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdThe best epoxy for metal to metal,plastic,glass and concrete, a one part system consisting of an epoxy resin and a hardener. The resin and hardener are combined to create a durable, high-strength bond that dries in minutes and can be used for repairing, filling, and rebuilding all metal and concrete surfaces. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdIn various industries, bonding glass to metal is a crucial process. It is vital to ensure that the bond between the glass and metal is solid and durable to maintain the integrity of the structure or device. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdIndustrial strength adhesive glues are designed to provide strong and durable bonds for various applications in industrial settings. These glues are typically formulated to bond a wide range of materials, including metals, plastics, ceramics, glass, and wood. They offer excellent strength, resistance to temperature, chemicals, and environmental conditions. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdDeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology of industrial epoxy adhesive. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdDeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdThe product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range. Read more...
More Product Announcements from Shenzhen DeepMaterial Technologies Co., LtdFLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY G6E-FXNS
Our Conductive Silver/Carbon Flexible Epoxy G6E-FXNS Epoxy has been developed for applications that require high flexibility of solderless interconnections such as wearable electronics, flexible wires, and sensors.
KEY FEATURES
- Highly Flexible Silver/Carbon filled epoxy
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G6E-TSHV High Thermally Conductive , Non-Electrically Conductive Epoxy
Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials
Eliminate the weighing and mixing of adhesives and resins. Read more...
More Product Announcements from Ellsworth Adhesives