Henkel Corporation - Electronics

LOCTITE ABLESTIK CF 3350 offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications. Read more...

More Product Announcements from Henkel Corporation - Electronics
Ellsworth Adhesives

One structural adhesive that boasts both high durability and outstanding peel and sheer adhesion is Scotch-Weld™ DP420 from 3M. Read more...

More Product Announcements from Ellsworth Adhesives
Master Bond, Inc.

Master Bond Supreme 45HTQ-4 is a two component, toughened, silicon carbide filled epoxy for high performance bonding, sealing and casting. Read more...

More Product Announcements from Master Bond, Inc.
Master Bond, Inc.

Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments. Read more...

More Product Announcements from Master Bond, Inc.
Epoxy Technology

This FREE presentation explains the mechanism of action of epoxy (cationic) UVs and acrylic (free radical) UVs, along with best practices for proper curing. The discussion will include a complete review of proper UV lamp selection (type and format), proper exposure/intensity (and measurement), and optimal product selection (cationic or free radical). Read more...

More Product Announcements from Epoxy Technology
Master Bond, Inc.

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies. This system utilizes a special blend of highly thermally conductive filler material that is capable of being applied in bond lines as thin as 10-15 microns. Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including elevated tempe... Read more...

More Product Announcements from Master Bond, Inc.
Master Bond, Inc.

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. Read more...

More Product Announcements from Master Bond, Inc.
Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. Read more...

More Product Announcements from Master Bond, Inc.
Master Bond, Inc.

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it is also a candidate for electronic potting and sealing applications. Read more...

More Product Announcements from Master Bond, Inc.
Epoxy Technology

Epoxy Technology announces an expanded line of solar adhesive products for thin film panel assembly. Read more...

More Product Announcements from Epoxy Technology