Suntech Applied Materials (Hefei) Co.,Ltd

As the scale of integrated circuit design to increase, the design of the package is becoming more and more complicated. The general package can’t meet the electrical, mechanical and reliability requirements, and the demand of package customization has become more and more obvious. Read more...

More Product Announcements from Suntech Applied Materials (Hefei) Co.,Ltd
Suntech Applied Materials (Hefei) Co.,Ltd

Gel plunger has more advantages compared with other molding methods and is more competitive in the subsequent market competition. Read more...

More Product Announcements from Suntech Applied Materials (Hefei) Co.,Ltd
Suntech Applied Materials (Hefei) Co.,Ltd

Gel plunger has more advantages compared with other molding methods and is more competitive in the subsequent market competition. Read more...

More Product Announcements from Suntech Applied Materials (Hefei) Co.,Ltd