Product Announcements:
Specialty Ceramics

The manufacturing of the latest generation of alumina-toughened zirconia (ATZ) composite ceramic hip joint balls presents significant challenges, making it a highly specialized and technically demanding process. This material, which optimizes the performance of the first three generations of hip joint balls, is considered the most suitable for hip joint replacements due to its superior m... Read more...

HTCC multilayer co-fired ceramic substrate packaging technology is an advanced electronic packaging technology, which utilizes the unique properties of HTCC materials, such as high mechanical strength, high thermal conductivity, good chemical stability and high wiring density, to achieve high-performance electronic packaging. Read more...

There are many connection methods between ceramic and metal, such as brazing, diffusion welding, fusion welding and oxide glass solder connection method, among which brazing method is one of the main methods to obtain high strength ceramic/metal joint. Read more...

As integrated circuit has become a strategic industry, many semiconductor materials have been researched and developed, and AlN is undoubtedly one of the most promising semiconductor materials. Read more...

The main material of ceramic heater is AIN. It is sintered with complex tungsten circuits, with fast thermal response and uniform temperature, and can integrate temperature sensors. Read more...

Empowering High-Performance Electronics with Superior Heat Dissipation Read more...

Ceramic surface metallization is mainly used in ceramic and kovar alloy brazing, high gas-tight ceramic-kovar alloy welding welding, metallized in its welding position, and then brazing. By improving the infiltration of metal solder on the ceramic surface, and the metallization layer as the intermediate layer, forming a firm connection with the metal solder through metallurgical combinat... Read more...

Ceramic packages, also known as ceramic encapsulation packages, are encapsulation shells made from ceramic materials. Depending on the structure, ceramic packages can be categorized into various types, including Ceramic Pin Grid Array (CPGA),Ceramic Ball Grid Array (CBGA), and Ceramic Quad Flat No-lead (CQFN), among others. Based on different raw materials, ceramic packages can also be d... Read more...

Mullite has a high melting point, good thermal stability at high temperature, better mechanical properties,its mechanical properties increase with the increase of temperature, lower dielectric constant and thermal expansion coefficient, good resistance to heat shock performance and air tightness. Due to its excellent physical and chemical properties, molite ceramics are widely used in hi... Read more...

Ceramic metallization is a process in which a layer of metal is deposited onto the ceramic surface to provide a wettable surface for subsequent brazing.

INNOVACERA metallizes precision ceramic components for use in power grid tubes, vacuum interrupters, and similar applications. Our metalized parts are used in critical assemblies brazed by our in-house team or by other brazing sup... Read more...