Semiconductor fabricators are looking for solutions that deliver high performance and enhanced reliability for advanced packages. MacDermid Alpha's MICROFAB SC-40 PLUS next-generation acid copper electroplating process represents a leap forward in semiconductor manufacturing, providing fabricators with a transformative solution that combines precision, efficiency, and ease of use. Read more...
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MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry. Designed with enhanced uniformity to meet the semiconductor industry's demand for precision, reliability, and performance. Read more...
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MacDermid Alpha Electronics Solutions has released Systek UVF 100, a single step micro via filling and fine line plating process for 2 in 1 RDL applications. This product is part of the larger Systek family of IC Substrate manufacturing solutions. Read more...
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MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additi
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.
As the 5G standard is growing outward from the highest tier smartphones, board manufacturers of these devices need to increase... Read more...
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Protective layers for technical precious metal surfaces — Umicore sealing Read more...
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Quality Benefits
- Best possible coating quality
- Possible to create complex shapes
- Durable and dimensionally stable
Cost Benefits
- Long lifespan (procurement price pays off)
- Cheap re-plating (can be re-used several times)
- No production downtime due to maintenance
- Energy saving (better c...
RHODUNA®-Alloy 1 Technical Rhodium-Ruthenium-El
Meets the new requirements for wearables and mobile phones. Read more...