Indium Corporation

Indium Corporation was founded in 1934 in Utica, NY by Dr. William S. Murray—a man who dedicated his life to investigating and developing the uses of indium metal. Since those early days, the company has continued to lead and support the advancement of technologies on which we rely today. Read more...

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Indium Corporation

From flat panel displays to cryogenic seals and thermal interfaces to stretchable electronics, Indium’s materials are literally all around us. Because of their unique properties with virtually limitless applications Indium’s liquid alloys are a valuable tool in engineers’ tool kits. Read more...

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Indium Corporation

Indium Corporation - These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages... Read more...

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Indium Corporation

Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... Read more...

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