Fujipoly® America Corp.

SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus therma... Read more...

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Boyd Corporation

Overcoming harsh environments when exploring another planet challenges even the best engineering teams to ensure electronics can and continually operate in varying and unfamiliar conditions. Preparing to explore the Martian surface required creativity, determination, innovation, and perseverance. Read more...

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Shiu Li Technology Co., Ltd

Ultra Low Oil-Bleeding Gel Pad: AS200
LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. Read more...

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Henkel Adhesive Technologies - Aviation, Space and Rail

Save your seat now, April 28th at 11:00 am EDT or 8:00 am PDT

Join our Henkel Expert Talks with Alpha Space Test and Research Alliance, LLC on Space Market: Challenges of Thermal Management Applications in Small & Large Satellite. Read more...

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Shiu Li Technology Co., Ltd

  • Nano-Thermal Interface Grease: TT3000
  • Thermal Interface Grease: G3380
  • Thermal Interface Grease: G338N Non-silicone
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Shiu Li Technology Co., Ltd

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. Read more...

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Epoxy Technology

The best way to improve Thermal Management in Microelectronics Design starts with a better understanding of Thermally Conductive Adhesives and Thermal Conductivity Measurement Methods
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