ArKco Sales, Inc.

Laird's CoolZorb material assists design engineers to solve both EMI compliance and thermal management issues that originate from a specific component or board. There are three lines of CoolZorb: CoolZorb 400, CoolZorb 500, and CoolZorb 600. Read more...

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ArKco Sales, Inc.

Laird has launched their Kzorb hybrid material. Kzorb is a hybrid family of products consisting of a flexible dielectric silicone layer and a flexible microwave absorbing layer. This system provides RF and microwave insulation combined with RF and microwave absorbing functions. Read more...

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Fujipoly® America Corp.

Sarcon® 15GTR from Fujipoly® is a thin, thermal interface composite film made from heat-conducting silicone and a .05mm fiberglass reinforcement layer. The general-purpose, .15mm thick film is ideal for applications with complex die-cut shapes. Read more...

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Master Bond, Inc.

Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Read more...

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Fujipoly® America Corp.

Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon® EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient tr... Read more...

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Fujipoly® America Corp.

Sarcon® 30XR-m from Fujipoly® is a high-performance thermal interface material that exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape. Read more...

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Fujipoly® America Corp.

Sarcon® 20YR-c from Fujipoly® is a versatile 0.2mm film that exhibits a thermal conductivity of 4.0 W/m•K and a thermal resistance of only .12° C•in2/W. This product is ideal for transferring performance-killing heat from high power semiconductors and board-level components to nearby cooling heatsinks. Read more...

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Fujipoly® America Corp.

Some of the most cumbersome steps in evaluating the performance of a thermal interface material are requesting product samples and receiving quotes. To eliminate this frustration, Fujipoly® created an online suite of features that allow engineers to request complimentary samples and/or quotes with the click of a mouse.

The registration process takes under 2 minutes to c... Read more...

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MINTEQ® International Inc, Pyrogenics Group

Intumescent Fire Retardant Coatings Firex™MINTEQ® Firex™ intumescent fire retardant coatings have provided fire protection for personnel and property for over 30 years Read more...

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MINTEQ® International Inc, Pyrogenics Group

Pyroid® HT Pyrolytic Graphite Material Provides "Diamond Like Thermal Performance Without the Diamond Price"

Pyroid® HT Pyrolytic Graphite Customer Benefits:

• Significant thermal spreading
• Fast and Uniform Thermal Response
• Weight savings
• Direct solder attachment

Get a Copy of Pyroid® HT Heat Sink/Spread... Read more...

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