Product Announcements:
Thermal Compounds and Thermal Interface Materials

UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes. Read more...

Highly Conformable and Non-Flammable, Higher Thermal interface materials Read more...

LiPOLY DM series is a two-part liquid gap filler for different heights of design gap with a fast-curing feature. Low Viscosity. Thermal Conductivity: 2.2 W/m.k~7.0 W/m.k. Available for dispensing machines. Read more...

TT3000 provides superior performance and reliability while mitigating against pump-out and floating issues on the interface. TT3000 improves the operating process while simultaneously providing high thermal conductivity and excellent low thermal resistance. This material will handle the most demanding of applications. Read more...

LiPOLY® PK700DM is a two-part, low viscosity with good thixotropic characteristics thermal conductivity gap filler. With a thermal conductivity of 7.0 W/m*K. PK700DM provides high thermal conductivity and low thermal impedance; ultra-conforming, a gel-like material after being cured for fragile and low-stress applications. Available in 50ml and 400ml cartridges. Read more...

LiPOLY® T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of
heat. Read more...

LiPOLY® has created a new advanced thermal interface material. H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Read more...

LiPOLY® SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity. Read more...

LiPOLY® TEM96 series is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 2~4.0 W/m*K. Read more...

LiPOLY DM series is two-part liquid gap filler for different heights of design gap with a fast-curing feature. Low Viscosity. Thermal Conductivity: 2.2 W/m.k~7.0 W/m.k. Available for dispensing machines. Read more...