Boyd Corporation

Consumer demand is hot for more compact, more powerful electronics. But the denser circuits required for smaller devices generate more heat, making higher performing thermal management materials a necessity. In this webinar, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat, even within tight spaces. Read more...

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Boyd Corporation

Low-cost thermal insulators designed for easy application and improved heat conductance. Read more...

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Boyd Corporation

Thermally conductive compounds that provide mechanical strength to the bond between the heat sink and heat source and allows no air in the interface area. Read more...

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Indium Corporation

Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test applications. Read more...

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Boyd Corporation

Thermally Conductive Gap Fillers are soft, malleable interface materials with high thermal conductivity. Gap fillers are ideal for applications with significant distances between the heat source and cooling surface, varying component heights, high tolerance stack up variability, and uneven or rough surfaces. Read more...

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Epoxy Technology

The best way to improve Thermal Management in Microelectronics Design starts with a better understanding of Thermally Conductive Adhesives and Thermal Conductivity Measurement Methods
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Henkel Corporation - Electronics

Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applicatons requiring isolation between heat sinks and high-voltage, bare-leaded devices. Read more...

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Henkel Corporation - Electronics

Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities Read more...

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Boyd Corporation

Liquid Cold plates are a critical component of a liquid cooled system. Aavid's liquid cold plate technology is the broadest range designed and manufactured in the industry. Our global capabilities enable us to develop and produce more efficient and compact cooling for extremely high heat loads while still maintaining design flexibility and reducing costs. Read more...

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