Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has a thermal conductivity of 2.3 W/mK and is non corrosive, fast skinning with low linear shrinkage. It is one of a family of products called acetone cure sealants that are solvent free. It exhibits excellent primerless adhesion to many substrates. The product is cured rapidly in contact with atmospheric mois... Read more...More Product Announcements from Techsil Limited
Momentive TIA350R from Techsil is a one-part, heat curable silicone adhesive designed for thermally conductive applications. It cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders, also suitable for use as an adhesive between various heat sources and heat dissipation devi... Read more...More Product Announcements from Techsil Limited
Customizable liquid, tapes, pads, or mix for the mechanical attachment of components to a heat sink with thermal transfer properties and without the need for additional fasteners. Read more...More Product Announcements from Henkel Corporation - Electronics
Effective thermal interface between heat sinks and electronic devices with shock dampening qualities for conformability and higher thermal performance, also available silicone-free. Read more...More Product Announcements from Henkel Corporation - Electronics
Techsil has launched SilCool* TIA241GF a thermally conductive, 'non slump' silicone gap-filler paste from Momentive. It is an excellent candidate for applications where good heat transfer, low stress, and good interface wetting are required. Read more...More Product Announcements from Techsil Limited
Sarcon® 30YR-c from Fujipoly® is a compliant silicone thin film that is ideal for filling near-microscopic air gaps that exist between high-power heat generating components and heatsinks. By increasing surface area contact, it is possible to measurably improve cooling effectiveness and operational performance.
Sarcon® 30YR-c is a high-performance 0.3mm thick material t... Read more...More Product Announcements from Fujipoly® America Corp.
In an effort to streamline your manufacturing process and improve transistor cooling, Fujipoly® offers a large assortment of box-shaped Sarcon® thermal interface caps. These cases are available in standard sizes to fit many transistors and can be custom ordered to your exact specifications. Installation takes seconds by sliding over the heat-generating component. Once fitted, unw... Read more...More Product Announcements from Fujipoly® America Corp.
Fujipoly® offers a large selection of thin film, thermal interface materials. Available in eight formulations, these Sarcon® materials offer versatility in managing heat dissipation while exhibiting useful characteristics such as electrical insulation, and UL94 VO flammability.
The Sarcon® series of thin films range in thickness from 0.15mm to 0.85mm. Depending on the... Read more...More Product Announcements from Fujipoly® America Corp.
Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges. HSMF-OS, a non-silicone based metal/polymer material, is designed for burn-in and test applications. Read more...More Product Announcements from Indium Corporation
BERGQUIST GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Read more...More Product Announcements from Henkel Corporation - Electronics