Product Announcements:
Thermal Compounds and Thermal Interface Materials

LiPOLY®’s BS series is an ultra-soft thermally conductive gel pad with high resilience characteristics which can avoid the deformation of PCB and other components caused by assembly stress. Hardness Shore OO/10-25 provide high flexibility, high compressibility, high insulation and good self-adhesiveness. Read more...

Pyroid® HT pyrolytic graphite thermal spreaders and thermal vias are a powerful new material solution in the battle against thermal heat in state-of-the-art electronic circuits and devices. Read more...

LiPOLY’s AS series has low oil-bleeding characteristics under high compression which can prevent the product from polluting electronic components due to silicon oil seepage, or combining with dust in the environment, causing dirt and affecting product appearance. Read more...

LiPOLY’s TIM14 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation. Read more...

LiPOLY® PK700DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 7.0 W/m*K, PK700DM provides high thermal conductivity and
low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe. Read more...

During the charging cycle of electric vehicles high temperatures are generated which need to be managed as they have a negative effect on the performance and lifetime of the components. Thermal Interface Materials are the materials of choice as they: Read more...

The charging infrastructure is key to the success of emobility. Customers expect short and effective charging times that power up the vehicle. With the charging times getting shorter the energy transported over the time gets higher. For this reason, management of heat flow and electrical insulation of the components become more demanding. Read more...

Non-Flammable 13-Watt Thermal Gap Filler Read more...

Features

• Thermal conductivity:6.0 W/m*K
• Stable and homogeneous compound
  to ensure thermal performance
• Solvent-free formula
• Nano type thermal interface material
• High stability and reliability
  

Non-Silicon Thermal Pads,17.0 W/m*K (N800C-s)

FEATURES

• No low molecular siloxane volatilization
• Low total volatile gas
• No electrical contact & pollution problems