Pre-applied semiconductor underfill, facilitating bump protection and interconnection in a single step. offering excellent bump reinforcement and safeguarding for fine pitch devices. Read more...More Product Announcements from Henkel Corporation - Electronics
Epoxy Technology, Inc. (EPO-TEK®) offers an expanded line of Room Temperature Curing Electrically Conductive Adhesives (ECAs). These ECAs are ideal for temperature sensitive substrates, allowing for a lower stress cure, best for large parts as well as high stress, temperature cycled parts. These epoxies require no oven curing; reducing capital costs and giving greater flexibility for... Read more...More Product Announcements from Epoxy Technology
Offering the highest levels of electrical conductivity, silver filled adhesives are ideal for a variety of applications where conductivity is of the utmost importance. This convenient brochure offers our top silver conductive systems at a glance. Read more...More Product Announcements from Master Bond, Inc.
Alpha is extremely well positioned for the growing trend towards increased electrification of the automotive powertrain, enabling the highest efficiency power electronics, while achieving a reduced form factor, lower cost and an unprecedented increase in reliability. Read more...More Product Announcements from MacDermid Alpha Electronics Solutions