Product Announcements:
Conductive Compounds

In response to the power semiconductor market's drive to improve reliability and device performance for automotive, alternative energy, transportation, consumer electronics, telecommunications and industrial applications, Alpha has developed a line of ALPHA® Argomax® advanced sinter technology products. Read more...

Epoxy Technology, Inc. (EPO-TEK®) offers an expanded line of Room Temperature Curing Electrically Conductive Adhesives (ECAs). These ECAs are ideal for temperature sensitive substrates, allowing for a lower stress cure, best for large parts as well as high stress, temperature cycled parts. These epoxies require no oven curing; reducing capital costs and giving greater flexibility for... Read more...

Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... Read more...

In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. LOCTITE GC 10 is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance. Read more...