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  • Packages Drop Testing
    The drop test, also known as the “package drop test machine�, is used to simulate the different edges, angles and faces of the product when it is dropped on the ground at different heights to understand the damage of the product and to evaluate the product packaging components when they fall
  • High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array Package Applications
    assembled usingSAC105, SACX Plus 0307, SAC125N, SAC305, Innolot and Maxrel Plus spheres. Test vehicle assembly used SAC305 solder paste for all alloys, except for Maxrel Plus BGAs, which were evaluated with both SAC305 and Maxrel Plus solder pastes. Single ball shear, drop shock and thermal cycling
  • Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
    In this study, the reliability of low Ag SAC alloy doped with Mn (SACM) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys. SACM is a patent pending alloy consisting of 0.5-1% Ag, 0.5-1% Cu
  • HLC (R) Connector Studies -Optical Return Loss & Multiple Mates
    It is well known within the test and measurement industry that Optical Return Loss (ORL) degrades at a higher rate than Insertion Loss on a test cord that is actively being used. The ORL measurement is very sensitive to contamination, endface defects, and endface geometries, and has a tendency
  • | Electronics Industry News for EEs & Engineering Managers
    Corvis demos optical equipment to quell critics Corvis Corp. made back-to-back demonstrations of its optical routing switch and optical add-drop multiplexer equipment at the recent National Fiber Optics Engineers Conference and NetWorld+Interop Fall, hoping to quell critics who say the company's
  • | Electronics Industry News for EEs & Engineering Managers
    lithography options Japan's Nikon Corp. here today (May 23) said it is evaluating its tool options amid Intel Corp.'s decision to drop 157-nm lithography from its roadmap. Teradyne appoints company exec as president Teradyne Inc. today announced that company executive Michael A. Bradley has been
  • | Electronics Industry News for EEs & Engineering Managers
    AlliedSignal completes purchase of Johnson Matthey Electronics Double-duty systems can program, test Cypress CPLDs MAJC combines multiprocessing, multithreading features Plunging prices for 128-Mbit DRAMs signal oversupply Credence reports first profitable quarter in a year Photronics says
  • | Electronics Industry News for EEs & Engineering Managers
    Oregon R &D unit for software, wireless products Alpha claims low-cost multi-chip module for high-frequency communications Workstation shipments drop due to memory shortages, says IDC MPU startup Transmeta files IPO Agilent sales jump 28% with surge in test, semiconductors Winbond's sales grow 63.6%
  • | Electronics Industry News for EEs & Engineering Managers
    of transponders consists of a 10-Gbits transmitter and receiver, 16:1 electrical mux/demux components, and clock and data recovery (CDR) circuits all in the same module. Semiconductor Alert! (Aug. 28-Sept. 1) Chip-testing houses struggle to get new ATE systems SAN JOSE -- Faced with expanding lead times
  • | Electronics Industry News for EEs & Engineering Managers
    announced a voluntary recall of a number of its mobile phone batteries after discovering one of its former suppliers knowingly supplied counterfeits. Worldwide IC sales to fall by 3% in September Worldwide semiconductor sales are projected to drop by 3 percent in September amid the current inventory
  • | Electronics Industry News for EEs & Engineering Managers
    in tester orders, part shortages stretch delivery times in Taiwan TAIPEI, Taiwan -- At the Semicon Taiwan trade show here, suppliers of automatic test equipment claim they are now scrambling to expand production to keep up with a surge in demand for chip testers--especially from an emerging crop of test
  • Global Clean Water Infrastructure
    SEEPEX continues to partner with Design Outreach DO to the benefit of those in need of clean water. As a result, SEEPEX has been featured in a new article titled, "Not a Drop to Drink" in the cover series of May's Pumps & Systems magazine. This article describes how water scarcity is a true test
  • Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics
    We present here the findings of Alpha's Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200oC. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted
  • Air-Coupled Acoustics: Sound PAT for Tablet Characterization
    determination in bilayered and multilayered tablets, active ingredient drop content measurements and micron-scale multiple layer coating thickness determination in tablets. Cetinkaya, C., Akseli, I., Mani, G.N., Libordi, C.F., Varghese, I., et al., Non-Contact Mechanical Characterization and Testing
  • | Electronics Industry News for EEs & Engineering Managers
    What's behind the ATE standards wars? SAN JOSE, Calif. -- During the Semicon West trade show here this week, suppliers of automatic test equipment (ATE) turned what could have been a sleepy event into major and vociferous battle over standards in the chip-testing business. Advantest Corp

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