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Supplier: Henkel Corporation - Industrial
Description: Underfills
- Coeff. of Thermal Expansion (CTE): 15.56 µin/in-F
- Viscosity: 10000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
- Coeff. of Thermal Expansion (CTE): 19.44 µin/in-F
- Viscosity: 5000 cP
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Description: The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has a higher glass transition temperature and higher fracture toughness, and can provide good protection for
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Low viscosity Fast flow Excellent wettability Excellent adhesion Ideal for high reliability applications Hi-Pb and Pb-free applications
- Coeff. of Thermal Expansion (CTE): 18.33 µin/in-F
- Viscosity: Up to 1900 cP
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Description: The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material has excellent mechanical properties and can protect solder joints during thermal cycling.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
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Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3808, Epoxy, Underfill LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal
- Coeff. of Thermal Expansion (CTE): 30.56 µin/in-F
- Viscosity: 360 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Features: Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, Thermal Insulation / Heat Insulating
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: MacDermid Alpha Electronics Solutions
Description: A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability. Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards. Product Overview ALPHA HiTech CU31-2030's low viscosity characteristic enables fast and efficient flow properties at room
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Supplier: MacDermid Alpha Electronics Solutions
Description: A one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards. Product Overview ALPHA HiTech CU13-3150 does not contain any fillers and is
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
- Chemical / Polymer System Type: Specialty / Other, Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Non-corrosive Cure
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Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Leveling / Filling Compound
- Industry: OEM / Industrial
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and
- Chemical / Polymer System Type: Epoxy (EP)
- Dissimilar Substrates: Yes
- Features: Electrical Insulation / Dielectric, Non-corrosive Cure
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Tooling / Mold Material
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Encapsulants and Potting Compounds - LOCTITE ECCOBOND UF 2800A reworkable underfill -- 8802603663361Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is amber in color. It is only available for purchase and use in China
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND UF 2800B reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is black in color. It is only available for purchase and use in China
- Industry: Electronics
- Use: Gap Filling Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 28.89 µin/in-F
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Supplier: Accuris
Description: JOINT INDUSTRY STANDARD Selection and Application of Board Level Underfill Materials
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Supplier: Henkel Corporation - Electronics
Description: (Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Supplier: Accuris
Description: JOINT INDUSTRY STANDARD Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
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Supplier: Master Bond, Inc.
Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
- Applied Thickness / Gap Fill: 0.0050 to 0.0150 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.22E7 to 1.33E7 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: DigiKey
Description: 3593 NON REWORKABLE UNDERFILL
- Chemical / Polymer System Type: Epoxy (EP)
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Description: Classic underfill, ultra-low viscosity suitable for most underfill applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 55.56 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Features: Electrically Insulating / Dielectric
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 4 to 5
- Features: Electrically Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Indium Corporation
Description: TACFlux® 26S is a NIA halogen-free, no-clean rework flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Halogen-free – no intentionally added (NIA) halogens Suitable for Pb-free or SnPb alloys Designed for flip-chip dipping applications Ultralow residue Compatible with underfills Bubble-free (airless) packaging
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Klinkau America, Inc.
Description: Klinkau welded membrane filter plates »Empty Chamber«welded design is the type of membrane plate for more difficult applications and allows squeezing into an empty or underfilled chamber without damages to the membrane. This »Empty Chamber« system is especially suited for
- Application / Industry Use: Chemicals, Food and Beverage
- Pressure Filtration Equipment: All Pressure Filters
- Sedimentation Equipment: All Sedimentation Equipment
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Dielectric Strength: 1067 kV/in
- Features: Encapsulating / Potting
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Supplier: Shurtape Technologies, LLC
Description: Heavy duty grade hot melt packaging tape for manual or automated industrial sealing of heavy, bulky cartons, including overstuffed or under-filled cartons, in high stress and extreme handling conditions. HP 500® is constructed to be tough with excellent grip and Hold Strong® technology,
- Adhesive: Hot Melt / Heat Activated, Pressure Sensitive (PSA), Rubber
- Carrier / Backing Material: Plastic / Polymer, Rubber
- Features: Permanent
- Peel Strength / Adhesion: 3.62 lbs/in
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passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
debris Improve quality through better weigh sorting of under-filled or underweight capsules and parts Reduce compressed air usage vs open nozzles Lower cost as compared to fans or blowers Application mobility, compared to large fans and blowers (read more)
Browse Pressure Intensifiers and Boosters Datasheets for Vortec -
specialized hardware design and manufacturing. We have expertise in several cutting-edge techniques for enhancing the durability of electronic components and assemblies, including underfill, staking, and unique printed circuit board (PCB) design techniques. All products are assembled at our (read more)
Browse PMC and XMC Modules Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
Vision/Detection Systems – As bottles move down the line, they need to be properly dried so that Vision and Detection Systems can properly detect any issues, such as underfilled bottles or crooked caps. The Paxton Products (read more)
Browse Manifolds and Manifold Systems Datasheets for Paxton Products, an ITW company -
level and reject any under-fills. Cans then are single-filed and returned to an upright position to pass under another bank of compressed air nozzles to ensure that the tops are dry before the multi-packaging step. A second PowerDry will replace this compressed air unit. In addition, the first (read more)
Browse Process Dryers Datasheets for Paxton Products, an ITW company
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Using PCB smt underfill epoxy and bga underfill material for different applications
Underfill applications make use of different adhesive compounds to fill up gaps that exist between PCBs and microchip packages. This is very important because different chip packages, like chip scale packages and ball grid arrays, have to be surface mounted.
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Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
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The Benefits And Applications Of Underfill Epoxy Encapsulants In Electronics
Underfill epoxy has become an essential component in ensuring the reliability and durability of electronic devices. This adhesive material is used to fill the gap between a microchip and its substrate, preventing mechanical stress and damage, and protecting against moisture and environmental
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Best Top 10 BGA Underfill Epoxy Adhesives And Underfill Encapsulants Manufacturers In China
Underfill epoxy adhesives offer good protection against ionic residues and unwanted substances. One of the key things that the underfill helps to achieve is better adhesion of components onto the substrate and shock protection. Today, the formulations include no flow underfills. This eliminates
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How to use a smt underfill epoxy adhesive in various applications
Underfill is a liquid polymer type applied to PCBs after going through a reflow process. After the underfill is placed, it is then allowed to cure, encapsulating the bottom side of a chip covering fragile interconnected pads between the board's top side and the chip's bottom side. Underfills offers
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An Overview Of BGA Underfill Process And Non Conductive Via Fill
Flip chip packaging exposes chips to mechanical stress because of extensive coefficient thermal expansion mismatch between the silicon chips and the substrate. When there is a high thermal load, the mismatch stresses the chips, thus making reliability a concern. Manufacturers use single underfill
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Best bga underfill epoxy adhesive glue solutions for excellent surface mount SMT component performance
There are many challenges that manufacturers face in different industries. These issues can only be handled by the use of underfill adhesives. There are many partial or full underfill solutions that allow fast cure and flowability at room temperature. It is important to find the best underfill
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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in
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Advanced Flip Chip Packaging
In support of the growth of flip chip, companion technologies such as substrate, underfill , interconnect, design, simulation…
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Area Array Packaging Handbook: Manufacturing and Assembly > NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING
Processing steps that could be eliminated are flux application, flux residue cleaning, underfill flow, underfill fillet processing…
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Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills , epoxy molding compounds…
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Moisture Sensitivity of Plastic Packages of IC Devices
From mate- rial perspectives, epoxy molding compounds, die attach adhesives, and underfill materials are all covered in…
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Wafer Level Underfill .
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Microvias: For Low Cost, High Density Interconnects > Assembly of Flip Chip on PCB/Substrate
…10 – 6/ºC) and the epoxy PCB (18.5 × 10 – 6/ºC), underfill encapsulant is usually…
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A Novel Three Dimensional Wafer Level Chip Scale Packaging
Technology-Manufacturing Process Development and Reliability Characterizations
…3D Packaging, Die to Wafer Integration, Silicon on Silicon, Pb-free Reflow, Capillary Underfill , No Flow Underfill…
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LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE
PACKAGES AND 01005 COMPONENTS
Underfill materials are often used to improve the reliability of a variety of electronic components.