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Supplier: Henkel Corporation - Industrial
Description: Underfills
- Coeff. of Thermal Expansion (CTE): 15.56 µin/in-F
- Viscosity: 10000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
- Coeff. of Thermal Expansion (CTE): 19.44 µin/in-F
- Viscosity: 5000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Low viscosity Fast flow Excellent wettability Excellent adhesion Ideal for high reliability applications Hi-Pb and Pb-free applications
- Coeff. of Thermal Expansion (CTE): 18.33 µin/in-F
- Viscosity: Up to 1900 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green. Snap curable Compatible with small gap sizes For flip chip on
- Coeff. of Thermal Expansion (CTE): 25.56 µin/in-F
- Viscosity: 3500 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Other
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Features: Electrically Insulating / Dielectric, Thermal / Heat Insulating
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Newark, An Avnet Company
Description: 3517 EPOXY UNDERFILL, 30CC SYRINGE
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
- Chemical / Polymer System Type: Specialty / Other, Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): Over 4.5
- Dielectric Strength: 450 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Other
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Description: DESCRIPTION "Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill. It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Other
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Description: DESCRIPTION This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between the electronic package and the
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Supplier: Newark, An Avnet Company
Description: 3549 - REWORKABLE UNDERFILL - 30ML - IDH# 910487
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Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Leveling / Filling Compound
- Industry: OEM / Industrial
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Reactive / Moisture Cured, Single Component System
- Dielectric Constant (Relative Permittivity): Over 4.5
- Dielectric Strength: Over 450 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA® HiTech™ CU31-3100 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU31-3100 makes it ideal for use in the automotive industry.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Other
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND UF 2800B reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is black in color. It is only available for purchase and use in China
- Industry: Electronics
- Use: Gap Filling Compound
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is amber in color. It is only available for purchase and use in China
- Industry: Electronics
- Use: Gap Filling Compound
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Description: This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between the electronic package and the assembly
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 28.89 µin/in-F
- Industry: Electronics
- Use: Gap Filling Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
- Industry: Electronics
- Use: Gap Filling Compound
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Supplier: Master Bond, Inc.
Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
- Applied Thickness / Gap Fill: 0.0050 to 0.0150 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.22E7 to 1.33E7 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Newark, An Avnet Company
Description: FAST FLOW,LOW TEMPERATURE CURE,REWORKABLE EPOXY UNDERFILL FOR BGA AND CSP DEVICES. HIGH ADHES AND RIGID CIRCUIT SUBSTRATES - 10 CC ML
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Supplier: Digi-Key Electronics
Description: 3593 NON REWORKABLE UNDERFILL
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Protavic America, Inc.
Description: Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 55.56 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Features: Electrically Insulating / Dielectric
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 4 to 5
- Features: Electrically Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: S&P Global Engineering Solutions
Description: JOINT INDUSTRY STANDARD SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
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Supplier: Indium Corporation
Description: TACFlux® 26S is a NIA halogen-free, no-clean rework flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: S&P Global Engineering Solutions
Description: GUIDELINE FOR SELECTION AND APPLICATION OF UNDERFILL MATERIAL FOR FLIP CHIP AND OTHER MICROPACKAGES *** CALL FOR QUOTE ***
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Supplier: Indium Corporation
Description: Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Halogen-free – no intentionally added (NIA) halogens Suitable for Pb-free or SnPb alloys Designed for flip-chip dipping applications Ultralow residue Compatible with underfills Bubble-free (airless) packaging
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Klinkau America, Inc.
Description: Klinkau welded membrane filter plates »Empty Chamber«welded design is the type of membrane plate for more difficult applications and allows squeezing into an empty or underfilled chamber without damages to the membrane. This »Empty Chamber« system is especially suited for
- Application / Industry Use: Chemicals, Food and Beverage
- Pressure Filtration Equipment: All Pressure Filters
- Sedimentation Equipment: All Sedimentation Equipment
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Dielectric Strength: 1067 kV/in
- Form / Function: Encapsulant / Potting Compound
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passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Henkel Adhesive Technologies - Aviation, Space and Rail
Henkel underfill for CSP & BGA high reliability
LOCTITE® Eccobond UF 1173 is a REACH compliant, highly filled underfill encapsulant designed to significantly extend the reliability performance of CSP and BGA packages with regards to thermal cycling, thermal shock and mechanical vibration or drops. LOCTITE Eccobond UF 1173 (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Henkel Adhesive Technologies - Aviation, Space and Rail -
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
designed for low-temperature—150°C—bismuth-tin applications. WS-3910 is chemically designed to exhibit minimal evaporation after application. Its composition also eliminates compatibility underfills by having a completely water-cleanable residue. WS-3910 (read more)
Browse Fluxes Datasheets for Indium Corporation -
BENEFITS Increase production rates by removing smoke, dust and debris Improve quality through better weigh sorting of under-filled or underweight capsules and parts Reduce compressed air usage vs open nozzles Lower cost as compared to (read more)
Browse Material Handling and Pneumatic Conveying Blowers Datasheets for Vortec -
specialized hardware design and manufacturing. We have expertise in several cutting-edge techniques for enhancing the durability of electronic components and assemblies, including underfill, staking, and unique printed circuit board (PCB) design techniques. All products are assembled at our (read more)
Browse PMC and XMC Modules Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
result, the plant has permanently turned off the second and third banks of compressed air nozzles. The first one remains active to provide an extra measure of confidence that cans will be dry. After coding, gamma inspection units from Filtec check the fill level and reject any under-fills (read more)
Browse Air Knives Datasheets for Paxton Products, an ITW company
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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in
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Selective Protection for PCBs
Glob Top, Dam and Fill & Flip Chip Underfill - To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections
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Understanding Low Outgassing Adhesives
filter. applications. * High-power voltage. supplies. * Optoelectronic assemblies. * Piezo devices. * Clean room applications. * Satellite assemblies. * Electronics underfill. applications. * Laser applications. * Mirrors (including. mirrors for telescopes). * Bonding voice coil to. suspension arm
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Indicates content that may require registration and/or purchase.
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Advanced Flip Chip Packaging
In support of the growth of flip chip, companion technologies such as substrate, underfill , interconnect, design, simulation…
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Area Array Packaging Handbook: Manufacturing and Assembly > NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING
Processing steps that could be eliminated are flux application, flux residue cleaning, underfill flow, underfill fillet processing…
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Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills , epoxy molding compounds…
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Moisture Sensitivity of Plastic Packages of IC Devices
From mate- rial perspectives, epoxy molding compounds, die attach adhesives, and underfill materials are all covered in…
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Wafer Level Underfill .
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Microvias: For Low Cost, High Density Interconnects > Assembly of Flip Chip on PCB/Substrate
…10 – 6/ºC) and the epoxy PCB (18.5 × 10 – 6/ºC), underfill encapsulant is usually…
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A Novel Three Dimensional Wafer Level Chip Scale Packaging
Technology-Manufacturing Process Development and Reliability Characterizations
…3D Packaging, Die to Wafer Integration, Silicon on Silicon, Pb-free Reflow, Capillary Underfill , No Flow Underfill…
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LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE
PACKAGES AND 01005 COMPONENTS
Underfill materials are often used to improve the reliability of a variety of electronic components.
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PROCESS DEVELOPMENT OF DOUBLE BUMP FLIP CHIP WITH
ENHANCED RELIABILITY AND FINITE ELEMENT ANALYSIS
…consisted of the original solder bumps protected by a wafer applied, low CTE underfill and a second…
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FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT
Good solder wetting and void free underfill were achieved.