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  • No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
    No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in
  • Selective Protection for PCBs
    Glob Top, Dam and Fill & Flip Chip Underfill - To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections
  • Understanding Low Outgassing Adhesives
    filter. applications. * High-power voltage. supplies. * Optoelectronic assemblies. * Piezo devices. * Clean room applications. * Satellite assemblies. * Electronics underfill. applications. * Laser applications. * Mirrors (including. mirrors for telescopes). * Bonding voice coil to. suspension arm

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