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Help with Semiconductor Wire and Wedge Bonders specifications:

Bonders
   Type       
   Your choices are...         
   Thermocompression Ball Bonder       Thermocompression uses pressure and temperature to create an intermetallic bond. A “free air ball” is created by a spark from an “electronic flame off” or EFO underneath the capillary before bonding takes place.  
   Thermosonic Ball Bonder       Thermosonic adds ultrasonic energy to pressure and temperature to create an intermetallic bond. A “free air ball” is created by a spark from an “electronic flame off” or EFO underneath the capillary before bonding takes place.  
   Wedge Bonder       Wedge bonders use ultrasonic energy and pressure to create a bond between a wire and a bond pad. This process deforms the wire into a flat elongated shape of a wedge. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Automation       
   Your choices are...         
   Manual       The process requires full human interaction to be completed. 
   Semi-Automatic       Semi-automatic machines allow a single operator to perform routine activities quickly and accurately. 
   Automatic       Automatic machines perform activities without operator intervention.  
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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