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Thick Film Type:

Material Type:

Dielectric Strength:

Electrical Resistivity:

Thermal Conductivity:

Process Temperature:

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Thick Film Type
           
   Your choices are...         
   Conductor       Thick film material can produce electrically conductive coatings or depositions. 
   Dielectric       Thick film material can produce electrically insulating or dielectric coatings or depositions. 
   Overglaze       Overglaze materials provide mechanical protection to the circuit. They are vitreous glasses fired at a relatively low temperature designed to improve the stability of the circuit after laser trimming operations. 
   Resistor       Thick film material can produce electrically resistive coatings or depositions. 
   Other Type       Other unlisted, specialized, or proprietary thick film material. 
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Material Type
           
   Your choices are...         
   Aluminum       Systems for deposition of aluminum for microelectronic conductors or interconnects, reflectors, or other commercial applications. 
   Barrier / Refractory Metal (W, Mo, Ti)       Barrier systems such as tungsten, molybdenum, or other refractory metals provide a diffusion barrier to prevent the high conductivity copper current carriers from poisoning the silicon in microelectronic conductors or interconnects. 
   Copper       Copper, brass, and bronze alloys are non-ferrous metals with excellent electrical and thermal conductivity as well as good corrosion resistance, ductility, and strength. 
   Gold / Gold Alloy       Gold has extremely high corrosion resistance, resulting in high-reliability electrical contacts even under light load conditions. Gold forms useful contact alloys with silver, copper, nickel, cobalt, platinum, and palladium. Major drawbacks are high cost, poor sliding friction characteristics, and low erosion resistance. 
   Iridium / Iridium Alloy       Iridium is very corrosion resistant and forms useful alloys with platinum and osmium. A major drawback is the high cost of iridium metal and its alloys.  
   Palladium / Palladium Alloys       Palladium has good erosion resistance and high corrosion resistance with low material transfer. Palladium forms useful alloys with copper and ruthenium. Major drawbacks are high cost and the development of high contact resistance films in the presence of organic vapors. 
   Platinum / Platinum Alloys       Platinum has very high erosion and corrosion resistance with low contact resistance. Platinum forms useful alloys with iridium, ruthenium, and tungsten. Major drawbacks are high cost and the development of high contact resistance films in the presence of organic vapors. 
   Silver / Silver Alloy       Silver has the highest conductivity of all metals. Its high conductivity, softness or low hardness, and high resistance to oxidation make silver an excellent choice for contact materials. Silver is strengthened with additions of copper, but this affects its conductivity. Fine silver is silver with very high purity (99.99% Ag). Pure or fine silver is too soft for most commercial applications, but is used as a starting component to form other silver-based alloys. 
   Aluminum Nitride       Aluminum nitride (AlN) ceramics are compounds of aluminum metal and nitrogen. Aluminum nitride is relatively inert and its good thermal conductivity combined with high electrical insulation ability makes these materials useful as substrates, insulators, and barrier layers in microelectronics applications. 
   Aluminum Oxide / Sapphire       Alumina or aluminum oxide (Al2O3 ) is a compound of aluminum metal and oxygen usually used in the alpha alumina structural form. In its pure form alumina is a white, high hardness ceramic. Fully dense alumina can be translucent. Alumina has found wide application due to its versatility and a relatively low raw material cost. Depending on the purity and density, alumina is used for refractory tubes, industrial crucibles, analytical labware, dielectric substrates, wear components, refractory cements, and abrasives. Alumina's main drawback is its relatively poor thermal shock resistance due its higher coefficients of thermal expansion and lower thermal conductivity compared to other pure ceramic materials such as SiC.  
   Aluminum Zinc Oxide (AZO)       Aluminum zinc oxide (AZO) is a promising transparent conductive oxide for use in photovoltaics, flat panel displays, and glass heating applications. When fully developed, AZO thin film materials may provide a lower cost, less toxic alternative to ITO thin film materials. 
   Boride (ZrB2, TiB2)       Boride ceramics are compounds of a metal and boron such as zirconium boride (ZrB2) or titanium boride (TiB2 ). Titanium borides show an increase in ductility with an increase in temperature. 
   Carbide       Carbides are compounds of a metal or metalloid (B, Si) and carbon. Metal carbides are also known as hard metals such as tungsten carbide (WC), titanium carbide (TiC), or tantalum carbide (TaC). Metal carbides have high hardness and high hot hardness, which makes them useful for cutting tools, forming dies & tools, and other wear applications. Metal carbides often used a cobalt, nickel, or intermetallic metal bond between grains (cemented carbides) which results in increased toughness compared to a pure carbide or ceramic.   
   Carbon / Diamond-like Carbon (DLC)       Thick film material systems capable of producing deposits of carbon, graphite, or DLC (diamond-like carbon), which has hardness or other properties approaching those of diamond. 
   Cadmium Telluride (CdTe)       Thick film materials used to deposit cadmium telluride (CdTe) coatings. CdTe is a compound semiconductor. 
   Copper Indium Gallium Selenide (CIGS)       Thick film materials used to deposit copper indium gallium selenide (CIGS) coatings. CIGS is a compound semiconductor useful in solar or photovoltaic cell (PV) applications because of the high efficiency the material provides. 
   Fluoride / MgF2       Flourides such as magnesium fluoride or barium fluoride are useful in optical applications. 
   Gallium Arsenide (GaAs)       Thick film materials used to deposit gallium arsenide (GaAs) coatings. GaAs is a compound semiconductor. 
   Gallium Nitride (GaN)       Thick film materials used to deposit gallium nitride (GaN) coatings. GaN is a compound semiconductor. 
   Germanium       Material systems capable of depositing germanium thin film coatings. Germanium is an elemental intrinsic semiconductor. 
   Indium Tin Oxide (ITO)       Indium tin oxide (ITO) is a standard transparent conductive oxide used for photovoltaics, flat panel displays, and glass heating applications. 
   Lead Selenide  (PbSe)       Thick film materials used to deposit lead telluride (PbTe) coatings. PbTe is a compound semiconductor, which may provide a lower cost option for solar applications. 
   Nitrides / TiN       Nitride thick film material systems such as titanium nitride or silicon nitride are used as dielectric layers and for their wear resistance. 
   Oxides       Oxide thick film material systems such as silicon dioxide are used as dielectric layers, especially in silicon based semiconductor systems. Titanium oxide, tantalum oxide, and niobium oxides are oxides used for their electrical insulating or dielectric properties. Aluminum oxide coatings provide very wear resistant coatings. 
   Polymer / Organic       Polymer thick films used for printed circuits include aqueous based inks. They can deposit conductive, resistive, or insulating materials. 
   Silicon       Silicon raw material systems used to form depositions of epitaxial, amorphous, or polycrystalline silicon thin films. 
   Silicide (MoSi2)       Silicide ceramics are compounds of a metal and silicon such as molybdenum disilicide (MoSi2). Molybdenum disilicide is commonly used as a resistant heating element in high temperature furnaces. 
   Silicon Carbide (SiC)       Silicon carbide (SiC) is a compound of silicon metalloid and oxygen usually used in the alpha silicon carbide structural form. Silicon carbide can be a conductor or semiconductor depending on purity and doping. SiC is a black, high hardness ceramic that usually is harder than alumina. Depending on the impurity additions, silicon carbide is green or black in color.  Fully dense silicon carbide can be transparent (Moissanite).  Silicon carbide has found wide application due to its versatility and a relatively low raw material cost. Depending on the purity and density, SiC is used for refractory tubes, industrial crucibles, wafer semi-insulating substrates, wear components, refractory cements, and abrasives. Alumina's main drawback is its relatively poor thermal shock resistance compared to materials with lower coefficients of thermal expansion. SiC forms a protective SiO2 skin that prevents further oxidation at very high temperatures in non-reducing atmospheres. Silicon carbide has relatively high thermal shock resistance compared to other ceramic materials due to its low coefficient of thermal expansion combined with high thermal conductivity.   
   Silicon Oxide / Dioxide       Silica or silicon dioxide is a compound of silicon and oxygen. High purity amorphous fused silica is a high performance ceramic with very low expansion, remarkable thermal shock resistance, low thermal conductivity, excellent electrical insulation up to 1000°C, and excellent resistance to corrosion from molten metal and glass. 
   Zinc Selenide (ZnSe)       Thin film materials used to deposit zinc selenide (ZnSe) coatings. 
   Zinc Sulfide (ZnS)       Thin film materials used to deposit zinc sulfide (ZnS) coatings. ZnS is a compound semiconductor. 
   Specialty / Other       Other unlisted, specialized, or proprietary material. 
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Properties & Specifications
   Dielectric Strength       Dielectric strength is the maximum voltage field that the ceramic or material can withstand before electrical breakdown occurs. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Electrical Resistivity       Electrical resistivity is the longitudinal electrical resistance (ohm-cm) of a uniform rod of unit length and unit cross-sectional area. Electrical resistivity is the inverse of conductivity. High resistivity is a defining characteristic of a dielectric material. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Thermal Conductivity       Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)]. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Process Temperature       The process temperature (usually greater than 300 °C) is the temperature required to fix the layers in position permanently on the substrate by means of firing or sintering. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Film Thickness       The thickness of film to be printed, deposited, or coated on the substrate. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Applications
           
   Your choices are...         
   Battery / Fuel Cell       Material is suitable for use in battery or fuel cell as a collector plate, proton exchange membrane, or catalyst. 
   Decorative / Shielding       Material systems designed for coating onto plastics, glass, or other materials for decorative or electromagnetic shielding functions. 
   Die Bonding       Materials used to permanently attach a semiconductor die or chip to a package or substrate. 
   Electronics / Microelectronics       Material systems used in the manufacture of semiconductor materials or in the processing of semiconductor wafers into microelectronic components. 
   Display (FPD / OLED)       Materials for producing displays such as flat panel displays (FPD), organic light emitting diode displays (OLED), plasma displays, and other display products. 
   Magnetic Storage       Material systems for coating or processing magnetic storage products or components. 
   Medical / Biotech       Material systems used to provide coatings, implants or prostheses, medical devices, and surgical tools to enhance compatibility or functionality in medical applications. 
   MEMS       Material systems designed for manufacturing microelectromechanical (MEMS) devices, sensors, and components. 
   Passive Components       Materials used to fabricate passive components including capacitors and resistors. 
   Optical Coatings       Raw materials for deposition of thin films on lenses, fibers or mirrors, or other optical components. The films can be used to alter reflectivity, refractive index, or other properties. 
   Photovoltaic / Solar       Material systems designed for the production of photovoltaic or solar cells using silicon or other semiconducting materials. 
   Other       Other unlisted, specialized, or proprietary applications. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Features
           
   Your choices are...         
   Cadmium Free       Thick film materials free of cadmium additions. Cadmium is considered a health hazard. 
   Lead Free       Thick film materials are free of lead additions. Lead is considered to be a health hazard. 
   REACH Compliant       Registration, Evaluation and Authorization of Chemicals (REACH) is the European Union's standard for supply chain information exchange. The REACH standard provides a portal to facilitate communication with suppliers. If a product is submitted via the trader portal, the supplier portal sends an e-mail to the relevant exporter, requesting and providing details about the substances contained in the product. When more complex products are involved, exporters can also include their own sub-suppliers in the automatic substance query. 
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS became effective on July 1, 2006. 
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