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Configuration:

Applications:

Supply Voltage (VS):

Bandwidth:

Slew Rate (SR):

VCT, Crosstalk:

dB

Operating Ambient Temperature:

Package Type:

Pin Count:

Number of Devices in Package:

Bilateral Switch?

Fault-Tolerant Protection?

Serial Input?

Short Circuit Protection?

Single Supply?

RoHS Compliant?

Help with IC Analog Crosspoint Switches specifications:

General Specifications
   Configuration       
   Your choices are...         
   8x8       This configuration has eight inputs and eight outputs crosspoint. 
   16x4       This configuration has sixteen inputs and four outputs crosspoint. 
   16x8       This configuration has sixteen inputs and eight outputs crosspoint. 
   16x16       This configuration has sixteen inputs and sixteen outputs crosspoint. 
   32x16       This configuration has thirty-two inputs and sixteen outputs crosspoint. 
   32x32       This configuration has thirty-two inputs and thirty two outputs crosspoint. 
   Other       This refers to other unlisted types of configuration. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Applications      The industrial field in which the device will be used. 
   Your choices are...         
   Audio       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for audio applications. 
   Automotive       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for automotive applications. 
   Avionics       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for avionics applications. 
   Commercial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications. 
   Communications       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for communications applications. 
   Computers       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for computer applications. 
   Data Acquisition       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for data acquisition applications. 
   Industrial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications. 
   Medical       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for medical applications. 
   Military       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications. 
   Portable Devices       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for portable-device applications. 
   Video       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for video applications. 
   USB Certified       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for universal serial bus (USB) applications. 
   Other       Other unlisted operating range. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Performance
   Supply Voltage (VS)       Supply voltage (VS) refers to the source voltage range. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Bandwidth       The power bandwidth or large-signal bandwidth of an amplifier refers to its ability to provide a maximum output voltage swing with increasing frequency. At certain frequencies the output will become slew-rate limited and the output will begin to degrade. This frequency is the upper limit of the power bandwidth and the output voltage at this frequency is the peak output swing of the amplifier. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Slew Rate (SR)       Slew rate is the rate of change of the output voltage in response to a step input. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   VCT, Crosstalk       The maximum crosstalk (voltage) between channels, expressed in decibels (dB). This also known as the channel-to-channel crosstalk between any two analog inputs. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Ambient Temperature:       This refers to the full-required range of ambient operating temperature. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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Package Characteristics
   Package Type       
   Your choices are...         
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. 
   DPAK       DPAK refers to a type of transistor outline package (T0-252). 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   SIP       SIP refers to a single inline package. 
   SOIC       SOIC refers to a small outline IC. 
   SSOP       SSOP refers to a shrink small outline package. 
   SOP       SOP is a small outline package. 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. 
   SOT       SOT packaging refers to a small outline transistor. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   PSOP       PSOP refers to a power small outline package. 
   QFP       QFP is a quad flat package. 
   TO-220       Transistor Outline is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. 
   TO-3       Transistor Outline is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. 
   TSSOP       TSSOP refers to thin shrink small outline L-leaded packages. 
   QSOP       QSOP refers to a quarter size outline package. 
   PLCC       PLCC refers to a plastic leaded carrier. 
   UCSP       UCSP refers to an ultra-chip scale package. 
   Other       This refers to other unlisted, specialized, or proprietary packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Devices in Package       This refers to the number of devices in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Features
   Bilateral Switch       The switch allows signals to be transmitted in either direction. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Chip Enable       The chip can be enabled or disabled by applying a logic signal to the chip enable (CE) pin. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   On-Chip ESD Protection       The chip has embedded protection against electrostatic discharge (ESD). 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Fault-Tolerant Protection       The device has protection for electrical faults. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Overcurrent Protection       The switch has circuitry for overcurrent protection. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Radiation Tolerant       The device is radiation tolerant. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Serial Input       The device accepts a serial input. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Short Circuit Protection       The switch has circuitry for short circuit protection. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Single Supply       The chip can operate with only one supply. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Thermal Protection       The device has an internal circuit for thermal protection. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Undervoltage Lockout       The device is protected against undervoltage by locking its input. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Standards and Certifications
   ELV Directive       End of Life Vehicles (ELV) Directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of July 1, 2003. Lead can still be used as an alloying additive in copper, steel, aluminum, and in solderable applications. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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