MRAM Specifications

Help with MRAM specifications:

Production Status

	Production Status
	Your choices are...
	Full Production		Devices are currently being manufactured.
	Discontinued		Devices are no longer available from the manufacturer, but may still be found in the supply chain.
	In Development		Devices are in development and not yet available.
	New Product		Devices are new products that have been announced by the manufacturer.
	Other		Other unlisted status types.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
	IC Package Type
	Your choices are...
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	SIP		Single in-line package (SIP).
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	TQFP		Thin quad flat package (TQFP).
	SOP		Small outline package (SOP).
	SOIC		Small outline integrated circuit (SOIC).
	TSOP		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	SSOP		Shrink small outline package (SSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	Other		Other unlisted, specialized, or proprietary IC packages.
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

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Organization

	Density		The capacity of the memory chip expressed in bits.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.
	Number of Words		The number of "rows" in the organization of the memory chip.  Each row stores a memory word and connects to a word line (one line of the memory bus) for addressing purposes.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Bits per Word		The number of "columns" in the organization of the memory chip. Each column connects to a sense / write circuit (a bit), which connects to data input/output lines of the chip.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

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Performance

	Supply Voltage:
	Your choices are...
	-5 V		The chip operates with -5 volts.
	-4.5 V		The chip operates with -4.5 volts.
	-3.3 V		The chip operates with -3.3 volts.
	-3 V		The chip operates with -3 volts.
	1.2 V		The chip operates with 1.2 volts.
	1.5 V		The chip operates with 1.5 volts.
	1.8 V		The chip operates with 1.8 volts.
	2.5 V		The chip operates with 2.5 volts.
	2.7 V		The chip operates with 2.7 volts.
	3 V		The chip operates with 3 volts.
	3.3 V		The chip operates with 3.3 volts.
	3.6 V		The chip operates with 3.6 volts.
	5 V		The chip operates with 5 volts.
	Other		Other unlisted supply voltages.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
	Cycle Time		Interval of time required to perform a single read or write operation and reset the internal circuitry so another operation can begin. Cycle time defines how much time is required between clock edges in a synchronous device.
	Search Logic:		All matching products will have a value less than or equal to the specified value.
	Operating Current		The minimum current needed for active chip operation.
	Search Logic:		All matching products will have a value less than or equal to the specified value.
	Standby Current		The minimum current needed for the operation of the chip while it is inactive.
	Search Logic:		All matching products will have a value less than or equal to the specified value.
	Power Dissipation		Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatts.
	Search Logic:		All matching products will have a value less than or equal to the specified value.
	Data Rate		The transfer speed in hertz.  This is the number of bits per second that can be moved internally in the chip.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.
	Access Time		A measurement of time in nanoseconds (ns) used to indicate the speed of memory. Access time is a cycle that begins the moment the CPU sends a request to memory and ends the moment the CPU receives the data it requested. Specifically, for a synchronous device it is the time, usually in ns, from a clock edge to when data is available at the output of a device. For an asynchronous device it is the time from the initiation of the read cycle to when the data output is available.
	Search Logic:		All matching products will have a value less than or equal to the specified value.
	Operating Temperature:		This is the full-required range of ambient operating temperature.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

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